RK80532KE0881M - Intel BX80532KE3200E

Intel Xeon BX80532KE3200E. Processor family: Intel® Xeon®, Processor socket: Socket 604 (mPGA604), Processor lithography: 130 nm. Market segment: Server, Number of Processing Die Transistors: 55 M, Processing Die size: 131 mm². Package type: Retail box. Processor package size: 42.5 x 42.5 mm

 

Specification:

 

Processor
Processor base frequency	2.8 GHz
Processor manufacturer	Intel
Cooler included	No
Processor codename	Nocona
Thermal Design Power (TDP)	103 W
Processor cache	1 MB
Processor ARK ID	27076
Processor threads	2
Processor operating modes	64-bit
Compatible chipsets	Intel® E7520
VID Voltage Range	1.25 - 1.4 V
CPU multiplier (bus/core ratio)	14
Bus type	FSB
Component for	Server/workstation
Processor lithography	90 nm
Processor family	Intel® Xeon®
Processor front side bus	800 MHz
Processor cores	1
Box	No
Processor socket	Socket 604 (mPGA604)
Processor series	Intel Xeon 800 MHz FSB
Processor cache type	L2
Power
Thermal Design Power (TDP)	103 W
VID Voltage Range	1.25 - 1.4 V
Technical details
Intel® Turbo Boost Technology	No
Intel® Hyper Threading Technology (Intel® HT Technology)	Yes
Number of Processing Die Transistors	125 M
Processing Die size	112 mm²
Embedded options available	Yes
Product type	1
Processor cache	1024 KB
Thermal Design Power (TDP)	103 W
Status	Discontinued
Processor series	Intel Xeon 800 MHz FSB
Market segment	Server
Intel Virtualization Technology (VT-x)	No
Processor cache type	L2
Bus type units	MHz
Bus bandwidth	800
Processor brand name	Intel Xeon
Last change	63903513
Product family	Legacy Intel Xeon Processor
Features
Thermal Design Power (TDP)	103 W
Processor ARK ID	27076
Number of Processing Die Transistors	125 M
Processing Die size	112 mm²
Embedded options available	Yes
Market segment	Server
Processor special features
Intel® Turbo Boost Technology	No
Intel® Hyper Threading Technology (Intel® HT Technology)	Yes
Intel Virtualization Technology (VT-x)	No
Operational conditions
Tcase	72 °C
Packaging data
Package type	Retail box