Heat Sink Compounds

Flexible chilled water distribution system for the InfraStruXure® InRow RC.  Specification:  Technical detailsHarmonized System (HS) code85079080

APC CDU Flexible Fluid Piping. Product color: White. Weight: 83.1 lbs (37.7 kg)

5-Pack | Re-sealable Syringes | Thermal Conductivity: 1.93 W/m-K at 25 °C or greaterThis 5-Pack of thermal paste works with a heat sink to improve heat dissipation from integrated computer chips such as CPUs. The thermal paste features CE and RoHS...

DeepCool EX750 high performance thermal paste is crafted for extremely low thermal resistance for efficient heat dissipation in any scenario. INDUSTRIAL GRADE THERMAL INTERFACE DeepCool EX750 offers extremely low thermal resistance that maximizes heat...

Easy to Apply With an ideal consistency, the MX-2 is very easy to use, even for beginners. The possibilities for its application and the most effectively way to avoid voids between CPU and cooler we show you in the video. Excellent Performance The...

Improves heat transfer between a CPU/chipset and heatsink with easy-to-use thermal padsThis 5 pack of Thermal Pads offers a suitable alternative to using heatsink paste/grease. The thermal pads remain solid at room temperature, and soften at heatsink...

Optimised Packaging Saves Resources A sustainable use of resources is really important for us at ARCTIC Thus we updated the packaging of the MX-4 to minimize it's CO2 Footprint. The practical, recyclable packaging bag of our thermal compound helps us...

Optimised Packaging Saves Resources A sustainable use of resources is really important for us at ARCTIC Thus we updated the packaging of the MX-4 to minimize it's CO2 Footprint. The practical, recyclable packaging bag of our thermal compound helps us...

1U AM2 Opteron 1000 Cooler

Thermaltake high performance and exceptional reliability Thermal grease, to maximize heat transfer by eliminating the minuite air gap between the heat source and the heat sink caused by their irregular surfaces.High Thermal ConductivityLighter, easier to...

TG-50 is a premium thermal compound for high standard cooling performance designed to lower CPU temperatures effectively.

TG-30 is a premium thermal compound for high standard cooling performance designed to lower CPU temperatures effectively. High Thermal Conductivity The thermal compound contains diamond powder, which would provide a thermal conductivity of 4.5 W/m-k...