U.2 Form Factor and Non-Volatile Memory Express (NVMe)
983 DCT 960GB NVMe SSDs in the M.2 form factor deliver blazing fast sequential read/write speeds up to 3,000/1,100 MB/s and random read/write speeds up to 400/38K IOPS. They also support PCI Express® (PCIe) Gen 3 x 4 lanes to provide high bandwidth and low latency.
Advanced ECC Engine and End-to-End Data Protection
Detect signal discrepancies and proactively remedy them in real time with the Error Correcting Code (ECC) engine. Secure data without performance degradation thanks to AES 256-bit encryption.
Power-Loss Protection
Protect data integrity from unexpected power loss with Samsung's advanced power-loss protection architecture. Using the electricity from a tantalum capacitor to provide enough time to transfer the cached data in the DRAM to the flash memory, you can be assured no loss of data.
V-NAND Technology
Samsung's V-NAND flash memory helps to overcome the limitations of conventional planar NAND architecture. It stacks 64 cell layers vertically over one another rather than trying to fit itself onto a fixed horizontal space, in order to provide high density and performance with a small footprint.
Sustained Performance
Built to handle the heavier workloads of servers, the 983 DCT delivers an exceptionally high level of sustained performance over the life of the SSD to meet the demands for increased data handling.
High Quality of Service (QoS)
Designed for server applications, the 983 DCT offers a high Quality of Service (QoS) for a consistent, predictable latency and IOPS.
S.M.A.R.T.
Monitor the computer drives proactively to detect and report various reliability indicators with Self-Monitoring, Analysis and Reporting Technology (S.M.A.R.T).
Dynamic Thermal Guard Protection
Safeguard the SSD from overheating by automatically controlling the speed of the CPU relative to its core temperature, by throttling back the performance to prevent thermal shutdown.
- M.2 form factor and NVMe (Non-Volatile Memory Express) interface deliver blazing fast speed
- End-to-end data protection to help ensure consistency over the entire data transfer path
- Power-loss protection helps to prevent data corruption in the case of power failure
- Designed for optimized performance in server applications thanks to Samsung's proprietary 3-bit MLC V-NAND
Specification:
Internal I/O | |
---|---|
Number of M.2 (M) slots | 1 |
Supported storage drive interfaces | Serial Attached SCSI (SAS) |
USB 2.0 connectors | 1 |
USB 3.2 Gen 1 (3.1 Gen 1) connectors | 1 |
TPM connector | Yes |
Power fan connector | Yes |
Number of SATA III connectors | 16 |
Number of chassis fan connectors | 5 |
EPS power connector (8-pin) | Yes |
CPU fan connector | Yes |
ATX Power connector (24-pin) | Yes |
Integrated SAS ports | 4 |
Technical details | |
Motherboard chipset | System on Chip |
Trusted Platform Module (TPM) | Yes |
Parallel processing technology support | Not supported |
Number of processors supported | 1 |
Number of DIMM slots | 16 |
Motherboard form factor | Extended ATX |
Component for | Server |
Thermal Design Power (TDP) | 200 W |
Sustainability certificates | RoHS |
Performance | |
Number of HDDs supported | 20 |
Motherboard chipset | System on Chip |
Trusted Platform Module (TPM) | Yes |
Motherboard form factor | Extended ATX |
Component for | Server |
Processor | |
Processor manufacturer | AMD |
Thermal Design Power (TDP) | 200 W |
Compatible processor series | AMD EPYC |
Processor socket | Socket SP3 |
Processor number of cores supported | 64 |
Lithography | 7 nm |
Memory | |
Supported memory types | DDR4-SDRAM |
Memory channels | Octa-channel |
Supported memory clock speeds | 2133,2400,2666,2933,3200 MHz |
Maximum internal memory | 128 GB |
Storage controllers | |
Number of HDDs supported | 20 |
Supported storage drive interfaces | Serial Attached SCSI (SAS) |
Graphics | |
Parallel processing technology support | Not supported |
On-board graphics adapter model | Aspeed AST2500 |
Rear panel I/O ports | |
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity | 2 |
USB 2.0 ports quantity | 2 |
VGA (D-Sub) ports quantity | 1 |
Ethernet LAN (RJ-45) ports | 1 |
COM ports quantity | 1 |
Network | |
Ethernet LAN | Yes |
Wi-Fi | No |
Ethernet interface type | 10 Gigabit Ethernet, Fast Ethernet, Gigabit Ethernet |
Features | |
Motherboard chipset | System on Chip |
Motherboard form factor | Extended ATX |
Component for | Server |
Expansion slots | |
Number of M.2 (M) slots | 1 |
PCI Express x8 (Gen 3.x) slots | 2 |
PCI Express x16 (Gen 3.x) slots | 5 |
BIOS | |
Clear CMOS button | Yes |
Processor special features | |
Trusted Platform Module (TPM) | Yes |
Operational conditions | |
Storage temperature (T-T) | -40 - 60 °C |
Operating temperature (T-T) | 10 - 40 °C |
Storage relative humidity (H-H) | 20 - 95% |
Operating relative humidity (H-H) | 8 - 80% |
Weight & dimensions | |
Width | 12" (305 mm) |
Depth | 13" (330 mm) |
Packaging content | |
Cables included | SAS |
Other features | |
Thermal Design Power (TDP) | 200 W |
PCI Express x8 (Gen 3.x) slots | 2 |
Number of processors supported | 1 |
Number of DIMM slots | 16 |
Supported DIMM module capacities | 16GB, 32GB |