LF80537NE0361M - Intel INTEL CELERON M 540 MOBILE

Intel Celeron Mobile 540. Processor family: Intel® Celeron® M, Processor socket: Socket 478, Processor lithography: 65 nm. Market segment: Mobile, Number of Processing Die Transistors: 291 M, Processing Die size: 143 mm². Package type: Retail box. Processor package size: 35mm x 35mm

 

Specification:

 

Processor
Processor base frequency	2.26 GHz
Processor manufacturer	Intel
Cooler included	No
Processor codename	Merom
Thermal Design Power (TDP)	31 W
Processor cache	1 MB
Processor ARK ID	36676
Processor model	570
Processor threads	1
Processor operating modes	64-bit
L2 cache speed	2.26 GHz
FSB Parity	No
Bus type	FSB
Processor lithography	65 nm
Processor family	Intel® Celeron®
Processor front side bus	533 MHz
Processor cores	1
Box	No
Processor socket	Socket 478
Processor series	Intel Celeron Processor 500 Series for Mobile
Processor cache type	L2
Graphics
On-board graphics card	No
Power
Thermal Design Power (TDP)	31 W
Technical details
Cache memory	1 MB
Intel® Turbo Boost Technology	No
Intel Trusted Execution Technology	No
Intel® Hyper Threading Technology (Intel® HT Technology)	No
Idle States	No
Execute Disable Bit	No
Enhanced Intel SpeedStep Technology	No
Number of Processing Die Transistors	291 M
Processing Die size	143 mm²
Number of Graphics & IMC Die Transistors	291 M
L2 cache speed	2.26 GHz
Intel Enhanced Halt State	No
Intel Demand Based Switching	No
Embedded options available	No
Product type	Processor
Processor cache	1024 KB
Intel 64	Yes
Thermal Design Power (TDP)	31 W
Status	Discontinued
Product name	Intel Celeron 570 (1M Cache, 2.26 GHz, 533 MHz FSB)
Processor series	Intel Celeron Processor 500 Series for Mobile
Market segment	Mobile
Launch date	Q2'08
Intel Virtualization Technology (VT-x)	No
Processor cache type	L2
Bus type units	MHz
Bus bandwidth	533
Born on date	Q2'08
Processor brand name	Intel Celeron
Last change	63903513
Product family	Legacy Intel Celeron Processor
Bus speed	533 MHz
Features
Thermal Design Power (TDP)	31 W
Processor package size	35mm x 35mm
Processor ARK ID	36676
Idle States	No
Execute Disable Bit	No
Number of Processing Die Transistors	291 M
Processing Die size	143 mm²
Number of Graphics & IMC Die Transistors	291 M
Embedded options available	No
Market segment	Mobile
Harmonized System (HS) code	8542310001
Export Control Classification Number (ECCN)	3A991.A.1
Commodity Classification Automated Tracking System (CCATS)	NA
Processor special features
Intel 64	Yes
Intel® Turbo Boost Technology	No
Intel Trusted Execution Technology	No
Intel® Hyper Threading Technology (Intel® HT Technology)	No
Enhanced Intel SpeedStep Technology	No
Intel Enhanced Halt State	No
Intel Demand Based Switching	No
Intel Virtualization Technology (VT-x)	No
Weight & dimensions
Processor package size	35mm x 35mm
Other features
Cache memory	1 MB