LF80537GG0332MN - Intel INTEL CORE2 DUO T5670 1.8G
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Intel
LF80537GG0332MN - Intel INTEL CORE2 DUO T5670 1.8G
$173.16
$96.20
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$76.96
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SKU:
LF80537GG0332MN
Availability:
In Stock
Weight:
1.00 LBS
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Calculated at Checkout
Intel Core T5670. Processor family: Intel® Core™2 Duo, Processor lithography: 65 nm, Processor manufacturer: Intel. Market segment: Mobile, Number of Processing Die Transistors: 291 M, Processing Die size: 143 mm². Processor package size: 35 x 35 mm
Specification:
| Processor | |
|---|---|
| Processor base frequency | 2 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Merom |
| Thermal Design Power (TDP) | 35 W |
| Processor cache | 2 MB |
| Processor ARK ID | 31728 |
| Processor model | T7250 |
| Processor threads | 2 |
| Processor operating modes | 64-bit |
| VID Voltage Range | 1.075 - 1.175 V |
| FSB Parity | No |
| CPU multiplier (bus/core ratio) | 10 |
| Bus type | FSB |
| Component for | Notebook |
| Processor lithography | 65 nm |
| Processor family | Intel® Core™2 Duo |
| Processor front side bus | 800 MHz |
| Processor cores | 2 |
| Box | No |
| Processor socket | Socket 478 |
| Processor series | Intel Core 2 Duo T7000 Series |
| Processor cache type | L2 |
| Power | |
| Thermal Design Power (TDP) | 35 W |
| VID Voltage Range | 1.075 - 1.175 V |
| Technical details | |
| Intel® Turbo Boost Technology | No |
| Intel Trusted Execution Technology | No |
| Intel® Hyper Threading Technology (Intel® HT Technology) | No |
| Execute Disable Bit | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Number of Processing Die Transistors | 291 M |
| Processing Die size | 143 mm² |
| Intel Demand Based Switching | No |
| Embedded options available | No |
| Product type | Processor |
| Processor cache | 2048 KB |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 35 W |
| Status | Discontinued |
| Processor series | Intel Core 2 Duo T7000 Series |
| Market segment | Mobile |
| Launch date | Q3'07 |
| Intel Virtualization Technology (VT-x) | Yes |
| Processor cache type | L2 |
| Bus type units | MHz |
| Bus bandwidth | 800 |
| Processor brand name | Intel Core2 Duo |
| Last change | 63903513 |
| Product family | Legacy Intel Core2 Processor |
| Bus speed | 800 MHz |
| Features | |
| Thermal Design Power (TDP) | 35 W |
| Processor package size | 35mm x 35mm |
| Processor ARK ID | 31728 |
| Execute Disable Bit | Yes |
| Number of Processing Die Transistors | 291 M |
| Processing Die size | 143 mm² |
| Embedded options available | No |
| Market segment | Mobile |
| Harmonized System (HS) code | 8542310001 |
| Export Control Classification Number (ECCN) | 3A991.A.1 |
| Commodity Classification Automated Tracking System (CCATS) | NA |
| Processor special features | |
| Intel 64 | Yes |
| Conflict-Free processor | No |
| Intel® Turbo Boost Technology | No |
| Intel Trusted Execution Technology | No |
| Intel® Hyper Threading Technology (Intel® HT Technology) | No |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel Demand Based Switching | No |
| Intel Virtualization Technology (VT-x) | Yes |
| Operational conditions | |
| Tjunction | 100 °C |
| Packaging data | |
| Package type | Retail box |
| Weight & dimensions | |
| Processor package size | 35mm x 35mm |
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