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LF80537GF0282MT - Intel INTEL CORE2 DUO MOBILE T5450

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SKU: LF80537GF0282MT
Availability: In Stock
Weight: 1.00 LBS
Shipping: Calculated at Checkout
46C566DB-4644-460E-8DA7-038C0B9646AB E06A9D60-42A9-4459-8131-FA3002495928
Intel Core T5450. Processor family: Intel® Core™2 Duo, Processor socket: Socket 478, Processor lithography: 65 nm. Market segment: Mobile, Number of Processing Die Transistors: 291 M, Processing Die size: 143 mm². Processor package size: 35mm x 35mm. Cache memory: 2 MB

 

Specification:

 

Processor
Processor base frequency1.8 GHz
Processor manufacturerIntel
Cooler includedNo
Processor codenameMerom
Thermal Design Power (TDP)35 W
Processor cache2 MB
Processor ARK ID35163
Processor modelT5670
Processor threads2
Processor operating modes64-bit
VID Voltage Range1.0375 - 1.3 V
Bus typeFSB
Component forNotebook
Processor lithography65 nm
Processor familyIntel® Core™2 Duo
Processor front side bus800 MHz
Processor cores2
Processor cache typeL2
Graphics
On-board graphics cardNo
Power
Thermal Design Power (TDP)35 W
VID Voltage Range1.0375 - 1.3 V
Technical details
Intel® Turbo Boost TechnologyNo
Intel Trusted Execution TechnologyNo
Intel® Hyper Threading Technology (Intel® HT Technology)No
Idle StatesYes
Execute Disable BitNo
Enhanced Intel SpeedStep TechnologyYes
Number of Processing Die Transistors291 M
Processing Die size143 mm²
Intel Demand Based SwitchingNo
Intel 64Yes
Thermal Design Power (TDP)35 W
Market segmentMobile
Intel Virtualization Technology (VT-x)No
Processor cache typeL2
Features
Thermal Design Power (TDP)35 W
Processor package size35 x 35 mm
Processor ARK ID35163
Idle StatesYes
Execute Disable BitNo
Number of Processing Die Transistors291 M
Processing Die size143 mm²
Market segmentMobile
Processor special features
Intel 64Yes
Intel® Turbo Boost TechnologyNo
Intel Trusted Execution TechnologyNo
Intel® Hyper Threading Technology (Intel® HT Technology)No
Enhanced Intel SpeedStep TechnologyYes
Intel Demand Based SwitchingNo
Intel Virtualization Technology (VT-x)No
Operational conditions
Tjunction100 °C
Weight & dimensions
Processor package size35 x 35 mm

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