LF80537GF0282MT - Intel INTEL CORE2 DUO MOBILE T5450
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Intel
LF80537GF0282MT - Intel INTEL CORE2 DUO MOBILE T5450
$173.16
$96.20
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$76.96
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SKU:
LF80537GF0282MT
Availability:
In Stock
Weight:
1.00 LBS
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Calculated at Checkout
Intel Core T5450. Processor family: Intel® Core™2 Duo, Processor socket: Socket 478, Processor lithography: 65 nm. Market segment: Mobile, Number of Processing Die Transistors: 291 M, Processing Die size: 143 mm². Processor package size: 35mm x 35mm. Cache memory: 2 MB
Specification:
| Processor | |
|---|---|
| Processor base frequency | 1.8 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Merom |
| Thermal Design Power (TDP) | 35 W |
| Processor cache | 2 MB |
| Processor ARK ID | 35163 |
| Processor model | T5670 |
| Processor threads | 2 |
| Processor operating modes | 64-bit |
| VID Voltage Range | 1.0375 - 1.3 V |
| Bus type | FSB |
| Component for | Notebook |
| Processor lithography | 65 nm |
| Processor family | Intel® Core™2 Duo |
| Processor front side bus | 800 MHz |
| Processor cores | 2 |
| Processor cache type | L2 |
| Graphics | |
| On-board graphics card | No |
| Power | |
| Thermal Design Power (TDP) | 35 W |
| VID Voltage Range | 1.0375 - 1.3 V |
| Technical details | |
| Intel® Turbo Boost Technology | No |
| Intel Trusted Execution Technology | No |
| Intel® Hyper Threading Technology (Intel® HT Technology) | No |
| Idle States | Yes |
| Execute Disable Bit | No |
| Enhanced Intel SpeedStep Technology | Yes |
| Number of Processing Die Transistors | 291 M |
| Processing Die size | 143 mm² |
| Intel Demand Based Switching | No |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 35 W |
| Market segment | Mobile |
| Intel Virtualization Technology (VT-x) | No |
| Processor cache type | L2 |
| Features | |
| Thermal Design Power (TDP) | 35 W |
| Processor package size | 35 x 35 mm |
| Processor ARK ID | 35163 |
| Idle States | Yes |
| Execute Disable Bit | No |
| Number of Processing Die Transistors | 291 M |
| Processing Die size | 143 mm² |
| Market segment | Mobile |
| Processor special features | |
| Intel 64 | Yes |
| Intel® Turbo Boost Technology | No |
| Intel Trusted Execution Technology | No |
| Intel® Hyper Threading Technology (Intel® HT Technology) | No |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel Demand Based Switching | No |
| Intel Virtualization Technology (VT-x) | No |
| Operational conditions | |
| Tjunction | 100 °C |
| Weight & dimensions | |
| Processor package size | 35 x 35 mm |
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