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Intel INTEL SVR SYST D50TNP1MHCPAC

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$3,178.24
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SKU: D50TNP1MHCPAC
Availability: In Stock
Weight: 12.73 LBS
Shipping: Calculated at Checkout
46C566DB-4644-460E-8DA7-038C0B9646AB E06A9D60-42A9-4459-8131-FA3002495928
Intel Server System D50TNP1MHCPAC Compute Module. Motherboard chipset: Intel C621A, Processor manufacturer: Intel. Supported memory types: DDR4-SDRAM, Maximum internal memory: 6000 GB, Memory bandwidth (max): 204.8 GB/s. Supported storage drive interfaces: PCI Express, Serial ATA, RAID levels: 0, 1. On-board graphics card model: Aspeed AST2500. Ethernet interface type: 10 Gigabit Ethernet

 

Specification:

 

Hard drive
RAID levels0, 1
Processor
Built-in processorNo
Number of processors supported2
Motherboard chipsetIntel C621A
Processor manufacturerIntel
Memory
Supported memory typesDDR4-SDRAM
Number of DIMM slots16
Maximum internal memory2000 GB
ECCYes
Memory bandwidth (max)204.8 GB/s
Memory channelsHexadeca-channel
Storage
Number of storage drives supported2
Supported storage drive interfacesPCI Express, Serial ATA
RAID levels0, 1
Performance
Intel Advanced Management TechnologyYes
Trusted Platform Module (TPM) version2.0
Trusted Platform Module (TPM)Yes
Intel Intelligent Power Node ManagerYes
Integrated BMC with IPMIYes
Graphics
On-board graphics card modelAspeed AST2500
Network
Ethernet LANYes
Ethernet interface type10 Gigabit Ethernet
Ports & interfaces
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity3
USB ports quantity3
VGA (D-Sub) ports quantity1
Serial ports quantity1
Number of SATA connectors2
Ethernet LAN (RJ-45) ports1
USB version3.2 Gen 1 (3.1 Gen 1)
Expansion slots
PCI Express x16 slots2
PCI Express slots version4.0
PCI Express OCuLink connectors (NVMe support)8
Features
Trusted Platform Module (TPM) version2.0
Trusted Platform Module (TPM)Yes
Integrated BMC with IPMIYes
Harmonized System (HS) code8473301180
Export Control Classification Number (ECCN)5A002U
Commodity Classification Automated Tracking System (CCATS)G157815L1
Embedded options availableNo
Number of UPI links3
Intel Node ManagerYes
Technical details
USB ports quantity3
Packaging content(1) Intel® Server Board DDR4 D50TNP1SBCR (1) 1U half-width module tray – iPN K53210 (1) 1U compute module air duct – iPN K61940 (2) 1U PCIe Riser (x16 PCIe slot and M.2 Connector) for D50TNP1SBCR board TNP1UCRRISER (2) 1U riser bracket to support TNP1UCRRISER – iPN K25206 (1) 1U Air-Cooled front Heat Sink TNP1UHSF (1) 1U Air-Cooled Rear Heat Sink TNP1UHSB (2) Processor carrier clip, for 3rd Gen Intel® Xeon® Scalable processor family iPN J98484 (2) M.2 heat sink assembly TNPM2HS
Number of storage drives supported2
Intel Virtualization Technology for Directed I/O (VT-d)Yes
Intel Advanced Management TechnologyYes
Trusted Platform Module (TPM) version2.0
Trusted Platform Module (TPM)Yes
Rack-Friendly boardYes
Intel Intelligent Power Node ManagerYes
Integrated BMC with IPMIYes
CPU configuration (max)2
Chassis typeRack (1U)
Target marketHigh Performance Computing
StatusLaunched
Riser slot 2 number of lanes16
Riser slot 1 number of lanes16
Launch dateQ2'21
Extended warranty available for purchase (select countries)Yes
Expected discontinuance date2025
Harmonized System (HS) code8473301180
Export Control Classification Number (ECCN)5A002U
Commodity Classification Automated Tracking System (CCATS)G157815L1
Logistics data
Harmonized System (HS) code8473301180
Processor special features
Intel Virtualization Technology for Directed I/O (VT-d)Yes
Intel Advanced Management TechnologyYes
Intel Intelligent Power Node ManagerYes
Intel® Optane™ Memory ReadyYes
Intel® AES New Instructions (Intel® AES-NI)Yes
Processor ARK ID210523
Design
Rack-Friendly boardYes
Chassis typeRack (1U)
Power
Thermal Design Power (TDP)205 W
Packaging data
Packaging content(1) Intel® Server Board DDR4 D50TNP1SBCR (1) 1U half-width module tray – iPN K53210 (1) 1U compute module air duct – iPN K61940 (2) 1U PCIe Riser (x16 PCIe slot and M.2 Connector) for D50TNP1SBCR board TNP1UCRRISER (2) 1U riser bracket to support TNP1UCRRISER – iPN K25206 (1) 1U Air-Cooled front Heat Sink TNP1UHSF (1) 1U Air-Cooled Rear Heat Sink TNP1UHSB (2) Processor carrier clip, for 3rd Gen Intel® Xeon® Scalable processor family iPN J98484 (2) M.2 heat sink assembly TNPM2HS
Other features
On-board graphics cardNo
CPU configuration (max)2
Target marketHigh Performance Computing
StatusLaunched
Riser slot 2 number of lanes16
Riser slot 1 number of lanes16
Launch dateQ2'21
Extended warranty available for purchase (select countries)Yes
Expected discontinuance date2025

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