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Intel INTEL AW80577SH0413M CORE2

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SKU: AW80577SH0413M
Availability: In Stock
Weight: 1.00 LBS
Shipping: Calculated at Checkout
46C566DB-4644-460E-8DA7-038C0B9646AB E06A9D60-42A9-4459-8131-FA3002495928
Intel Core P7350. Processor socket: Socket 478, Processor lithography: 45 nm, Processor manufacturer: Intel. Market segment: Mobile, Number of Processing Die Transistors: 410 M, Processing Die size: 107 mm². Processor package size: 35mm x 35mm

 

Specification:

 

Processor
Processor base frequency2.26 GHz
Processor manufacturerIntel
Cooler includedNo
Processor codenamePenryn
Thermal Design Power (TDP)25 W
Processor cache3 MB
Processor ARK ID42014
Processor modelP7550
Processor threads2
Processor operating modes64-bit
SteppingR0
CPU multiplier (bus/core ratio)8.5
Bus typeFSB
Processor lithography45 nm
Processor familyIntel® Core™2 Duo
Processor front side bus1066 MHz
Processor cores2
BoxNo
Processor socketSocket 478
Processor codeSLGF8
Processor seriesIntel Core 2 Duo P7000 Series
Processor cache typeL2
Power
Thermal Design Power (TDP)25 W
Technical details
Cache memory3 MB
Intel® Turbo Boost TechnologyNo
Execute Disable BitYes
Enhanced Intel SpeedStep TechnologyYes
Intel® Virtualization Technology (Intel® VT)No
Number of Processing Die Transistors410 M
Processing Die size107 mm²
Number of Graphics & IMC Die Transistors410 M
Embedded options availableNo
Processor codeSLGF8
Product typeProcessor
Processor cache3072 KB
Intel 64Yes
Thermal Design Power (TDP)25 W
StatusDiscontinued
Product nameIntel Core2 Duo P7550 (3M Cache, 2.26 GHz, 1066 MHz FSB)
Processor seriesIntel Core 2 Duo P7000 Series
Market segmentMobile
Launch dateQ3'09
Intel Virtualization Technology (VT-x)2
Processor cache typeL2
Bus type unitsMHz
Bus bandwidth1066
Born on dateQ3'09
Processor brand nameIntel Core2 Duo
Last change63903513
Product familyLegacy Intel Core2 Processor
Bus speed1066 MHz
Features
Thermal Design Power (TDP)25 W
Processor package size35mm x 35mm
Processor ARK ID42014
Execute Disable BitYes
Number of Processing Die Transistors410 M
Processing Die size107 mm²
Number of Graphics & IMC Die Transistors410 M
Embedded options availableNo
Processor codeSLGF8
Market segmentMobile
Harmonized System (HS) code8542310001
Export Control Classification Number (ECCN)3A991.A.1
Commodity Classification Automated Tracking System (CCATS)NA
Processor special features
Intel 64Yes
Intel® Turbo Boost TechnologyNo
Enhanced Intel SpeedStep TechnologyYes
Intel® Virtualization Technology (Intel® VT)No
Intel Virtualization Technology (VT-x)2
Operational conditions
Tjunction90 °C
Weight & dimensions
Processor package size35mm x 35mm
Other features
Cache memory3 MB
Intel® Virtualization Technology (Intel® VT)No
Processor codeSLGF8

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