Gigabyte MZ31-AR0 SOCKET SP3 AMD EPYC

AMD EPYC™ 7002 Series Processor (Rome) The next generation of AMD EPYC has arrived, providing incredible compute, IO and bandwidth capability – designed to meet the huge demand for more compute in big data analytics, HPC and cloud computing. - Built on 7nm advanced process technology, allowing for denser compute capabilities with lower power consumption - Up to 64 core per CPU, built using Zen 2 high performance cores and AMD’s innovative chiplet architecture - Supporting PCIe Gen 4.0 with a bandwidth of up to 64GB/s, twice of PCIe Gen 3.0 - Embedded security protection to help defend your CPU, applications, and data Higher Memory Speed AMD EPYC’s Rome 7002 Series processors feature faster 8 channel DDR4 memory lanes, supporting RDIMM or LRDIMM memory modules with a speed of up to 3200MHz (1 DIMM per channel) Get the Memory Performance Edge 3200Mhz Even at 2 DIMMS Per Channel On previous AMD server platforms, memory speed has been automatically downgraded by design when a user installed two DIMMs per channel. GIGABYTE has now developed a unique solution to overcome this performance downgrade headache: with our new 2nd Generation AMD EPYC 7002 Series server platforms, maximum memory speed (3200Mhz) is now supported even when using 2 DIMMS per channel*. GIGABYTE’s server platforms give you the performance edge, with more memory capacity at faster speeds than competing solutions! High-Speed Networking GIGABYTE offers 10Gb across dual ports on-board, ensuring that users can get the most out of their system and are well equipped for today’s traffic demands. The server’s network performance is boosted with full-line rate throughput and CPU overhead is reduced, leaving the EPYC to focus on the real compute tasks. Dense, High Speed Storage Support Onboard M.2 GIGABYTE AMD EPYC™ platforms are designed to support on-board ‘M.2’ storage devices for time-sensitive operations and leaves room on the standard storage for compute tasks. Delivering up to 32 Gb/s data transfer speeds, M.2 offers users considerably faster storage performance than current mSATA devices. Data Security TPM 2.0 Module GIGABYTE’s EPYC™ platform is designed to support Trusted Platform Modules (TPM - discrete cryptographic on-board processors). Carefully Selected Components GIGABYTE’s passive components are carefully selected to guarantee a stable operating environment and allow the processors and the memory to deliver their maximum performance. GIGABYTE’s server motherboards are built with long lasting components for a high degree of reliability and durability. GIGABYTE Server Management (GSM) is GIGABYTE’s proprietary multiple server remote management software platform, available as a free download from each GIGABYTE server product page. GSM is compatible with either IPMI or Redfish (RESTful API) connection interfaces, and comprises the following sub-programs: - GSM Server, a software program with an easy to use browser-based GUI to enable global remote monitoring and management of multiple GIGABYTE servers via each server node’s BMC. - GSM CLI, a command-line interface program to enable global remote monitoring and management of multiple GIGABYTE servers via each server node’s BMC. - GSM Agent*, a software program installed locally on each GIGABYTE server node that retrieves additional node information (CPU/Mem/HDD/PCI/…) from the OS and passes it to the BMC. This information can then be utilized by GSM Server or GSM CLI. - GSM Mobile, a remote server management mobile APP, available for both Android and iOS. - GSM Plugin, a plugin that allows the user to manage and monitor GIGABYTE server nodes within VMware’s vCenter. GSM Mobile for iOS and Android A GSM Mobile app is available for download for both iOS and Android mobile phones for remote server management on the go. Management through VMware vCenter A GSM Plugin is available for VMware’s vCenter, allowing the user to perform remote monitoring and management of GIGABYTE server nodes without having to switch to a separate software platform. GIGABYTE Management Console (AMI MegaRAC SP-X) This GIGABYTE server product utilizes a AMI MegaRAC SP-X platform for BMC server management, with a feature rich and easy to use browser-based graphical user interface. Notable features include: - RESTful API support (including the latest DMTF standards of Redfish) allows the administrator to integrate with 3rd party applications for server management - HTML5-based iKVM remote management client included as a standard feature, no additional add-on license required to purchase - Detailed FRU information from SMBIOS - Pre-event automatic video recording feature from 10 to 30 seconds - SAS / RAID controller monitoring feature Easy BIOS Refresh GIGABYTE has also developed this integrated function (requiring no additional software) that allows users to update the BIOS of motherboards through the BMC controller: - No need to install core components such as CPUs, memory, drives and OS - No need to power on the system (NB. PSU must be connected) - Update individual (IPMI 2.0) or multiple boards simultaneously (Command Line) Dynamic Fan Speed Control GIGABYTE servers are enabled with dynamic fan speed adjustment. Individual fan speed will be automatically adjusted according to the system’s current temperature (according to CPU, DIMM, M.2, HDD, GPU temperature sensors), to achieve the best cooling and power efficiency. When the BMC detects a temperature change, fan speed will be automatically adjusted accordingly. Fan speed profiles may also be manually created and edited when necessary according to the user’s custom requirements. Environmental Compliance GIGABYTE maintains its commitment to green products, and adheres to the latest RoHS regulations (in effect July 2017). VMware Technology Alliance Partner Recognized as an Advanced Partner in VMware’s Technology Alliance Partner (TAP) program enables GIGABYTE to rapidly develop and certify joint solutions or go-to-market products that leverage VMware virtualization and cloud solutions, enabling our customers to modernize their data centers and implement IT infrastructure and application services with speed, agility, and cost optimization. Enquire with your GIGABYTE sales representative for more information about combining or integrating this server product with VMware solutions.

 

Specification:

 

Internal I/O
Number of M.2 (M) slots	2
Supported storage drive interfaces	Serial Attached SCSI (SAS)
USB 2.0 connectors	1
USB 3.2 Gen 1 (3.1 Gen 1) connectors	1
TPM connector	Yes
Number of COM connectors	2
Number of chassis fan connectors	5
EPS power connector (8-pin)	Yes
CPU fan connector	Yes
ATX Power connector (24-pin)	Yes
Integrated SAS ports	10
Technical details
Motherboard chipset	System on Chip
Trusted Platform Module (TPM)	Yes
Parallel processing technology support	Not supported
Number of processors supported	1
Number of DIMM slots	16
Motherboard form factor	Extended ATX
Component for	Server
Thermal Design Power (TDP)	240 W
Sustainability certificates	RoHS
Performance
Number of HDDs supported	14
Motherboard chipset	System on Chip
Trusted Platform Module (TPM)	Yes
Motherboard form factor	Extended ATX
Component for	Server
Processor
Processor manufacturer	AMD
Thermal Design Power (TDP)	240 W
Compatible processor series	AMD EPYC
Processor socket	Socket SP3
Processor number of cores supported	64
Lithography	7 nm
Memory
Supported memory types	DDR4-SDRAM
Memory channels	Octa-channel
Supported memory clock speeds	2933,3200 MHz
Maximum internal memory	128 GB
Storage controllers
Number of HDDs supported	14
Supported storage drive interfaces	Serial Attached SCSI (SAS)
Graphics
Parallel processing technology support	Not supported
On-board graphics card model	Aspeed AST2500
Rear panel I/O ports
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity	3
VGA (D-Sub) ports quantity	1
Ethernet LAN (RJ-45) ports	2
COM ports quantity	1
Network
Ethernet LAN	Yes
Wi-Fi	No
LAN controller	Intel® I350-AM2
Ethernet interface type	Fast Ethernet, Gigabit Ethernet
Features
Motherboard chipset	System on Chip
Motherboard form factor	Extended ATX
Component for	Server
Harmonized System (HS) code	84733020
Expansion slots
Number of M.2 (M) slots	2
PCI Express x8 (Gen 3.x) slots	1
PCI Express x16 (Gen 3.x) slots	6
BIOS
Clear CMOS button	Yes
Processor special features
Trusted Platform Module (TPM)	Yes
Operational conditions
Storage temperature (T-T)	-40 - 60 °C
Operating temperature (T-T)	10 - 40 °C
Storage relative humidity (H-H)	20 - 95%
Operating relative humidity (H-H)	8 - 80%
Packaging data
Package width	16.1" (409 mm)
Package depth	14" (355 mm)
Package height	3.07" (78 mm)
Weight & dimensions
Package width	16.1" (409 mm)
Package depth	14" (355 mm)
Package height	3.07" (78 mm)
Width	12" (305 mm)
Depth	13" (330 mm)
Packaging content
Quick installation guide	Yes
Other features
Thermal Design Power (TDP)	240 W
Package width	16.1" (409 mm)
Package depth	14" (355 mm)
Package height	3.07" (78 mm)
PCI Express x8 (Gen 3.x) slots	1
Quick installation guide	Yes
Number of processors supported	1
Number of DIMM slots	16