CP80617004119AL - Intel KIT CORE I3-370M
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CP80617004119AL - Intel KIT CORE I3-370M
$442.40
$245.78
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SKU:
CP80617004119AL
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Weight:
1.00 LBS
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Intel Core i3-370M. Processor family: Intel® Core™ i3, Processor socket: PGA988, Processor lithography: 32 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 8 GB, Memory types supported by processor: DDR3-SDRAM. On-board graphics card model: Intel® HD Graphics, On-board graphics card base frequency: 500 MHz, On-board graphics card dynamic frequency (max): 667 MHz. Market segment: Mobile, PCI Express configurations: 1x16, Number of Processing Die Transistors: 382 M. Processor package size: 37.5mm x 37.5mm; 34mm x 28mm
Specification:
| Processor | |
|---|---|
| Processor base frequency | 2.13 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Arrandale |
| Memory bandwidth supported by processor (max) | 17.1 GB/s |
| Thermal Design Power (TDP) | 35 W |
| Processor cache | 3 MB |
| Processor ARK ID | 47663 |
| Processor model | i3-330M |
| Processor threads | 4 |
| System bus rate | 2.5 GT/s |
| Processor operating modes | 64-bit |
| Stepping | C2 |
| L3 cache speed | 2.13 GHz |
| CPU multiplier (bus/core ratio) | 16 |
| Bus type | DMI |
| Processor lithography | 32 nm |
| Processor family | Intel® Core™ i3 |
| Processor cores | 2 |
| Box | No |
| Processor socket | BGA 1288 |
| Processor code | SLBMD |
| Processor series | Intel Core i3-300 Mobile Series |
| Processor cache type | Smart Cache |
| Generation | 3rd Generation |
| Memory | |
| Maximum internal memory supported by processor | 8 GB |
| Memory types supported by processor | DDR3-SDRAM |
| Memory bandwidth supported by processor (max) | 17.1 GB/s |
| Supported memory types | DDR3-SDRAM |
| Memory channels | Dual-channel |
| ECC | No |
| Graphics | |
| Number of displays supported (on-board graphics) | 2 |
| On-board graphics adapter model | Intel® HD Graphics |
| On-board graphics adapter | Yes |
| On-board graphics adapter dynamic frequency (max) | 667 MHz |
| On-board graphics adapter base frequency | 500 MHz |
| Power | |
| Thermal Design Power (TDP) | 35 W |
| Technical details | |
| Thermal Monitoring Technologies | Yes |
| Intel® Turbo Boost Technology | No |
| Intel Trusted Execution Technology | No |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel Flex Memory Access | Yes |
| Intel FDI Technology | Yes |
| Intel Fast Memory Access | Yes |
| Intel Dual Display Capable Technology | Yes |
| Intel® Clear Video HD Technology (Intel® CVT HD) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | No |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| PCI Express slots version | 2.0 |
| PCI Express configurations | 1x16 |
| Number of Processing Die Transistors | 382 M |
| Processing Die size | 81 mm² |
| Number of Graphics & IMC Die Transistors | 177 M |
| Graphics & IMC Die Size | 114 mm² |
| Supported instruction sets | SSE4.1,SSE4.2 |
| L3 cache speed | 2.13 GHz |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Enhanced Halt State | Yes |
| Graphics & IMC lithography | 45 nm |
| Embedded options available | No |
| CPU configuration (max) | 1 |
| Processor code | SLBMD |
| Product type | Processor |
| Processor cache | 3072 KB |
| Intel Virtualization Technology for Directed I/O (VT-d) | No |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 35 W |
| Supported memory types | DDR3-SDRAM |
| Intel® Clear Video Technology for Mobile Internet Devices (Intel CVT for MID) | Yes |
| Status | Discontinued |
| Processor series | Intel Core i3-300 Mobile Series |
| Physical Address Extension (PAE) | 36 bit |
| Market segment | Mobile |
| Launch date | Q1'10 |
| Intel Virtualization Technology (VT-x) | Yes |
| Processor cache type | Smart Cache |
| Bus type units | GT/s |
| Bus bandwidth | 2.5 |
| Maximum memory | 8 GB |
| Processor brand name | Intel Core i3 |
| Last change | 63903513 |
| Product family | Previous Generation Intel Core i3 Processor |
| Bus speed | 2.5 GT/s |
| Features | |
| Maximum number of PCI Express lanes | 16 |
| Thermal Design Power (TDP) | 35 W |
| Processor package size | 37.5mm x 37.5mm; 34mm x 28mm |
| Processor ARK ID | 47663 |
| Thermal Monitoring Technologies | Yes |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| PCI Express slots version | 2.0 |
| PCI Express configurations | 1x16 |
| Number of Processing Die Transistors | 382 M |
| Processing Die size | 81 mm² |
| Number of Graphics & IMC Die Transistors | 177 M |
| Graphics & IMC Die Size | 114 mm² |
| Supported instruction sets | SSE4.1,SSE4.2 |
| Graphics & IMC lithography | 45 nm |
| Embedded options available | No |
| CPU configuration (max) | 1 |
| Processor code | SLBMD |
| Physical Address Extension (PAE) | 36 bit |
| Market segment | Mobile |
| Harmonized System (HS) code | 8542310001 |
| Export Control Classification Number (ECCN) | 3A991 |
| Commodity Classification Automated Tracking System (CCATS) | NA |
| PCI Express CEM revision | 2.0 |
| Processor special features | |
| Macrovision License Required | No |
| Intel Clear Video Technology | Yes |
| Intel Virtualization Technology for Directed I/O (VT-d) | No |
| Intel 64 | Yes |
| Conflict-Free processor | No |
| Intel® Turbo Boost Technology | No |
| Intel Trusted Execution Technology | No |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel Flex Memory Access | Yes |
| Intel FDI Technology | Yes |
| Intel Fast Memory Access | Yes |
| Intel Dual Display Capable Technology | Yes |
| Intel® Clear Video HD Technology (Intel® CVT HD) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | No |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Enhanced Halt State | Yes |
| Intel® Clear Video Technology for Mobile Internet Devices (Intel CVT for MID) | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| Intel® vPro™ Platform Eligibility | No |
| Operational conditions | |
| Tjunction | 105 °C |
| Maximum operating temperature | 90 °C |
| Weight & dimensions | |
| Processor package size | 37.5mm x 37.5mm; 34mm x 28mm |
| Other features | |
| Maximum internal memory | 8 GB |
| Maximum internal memory | 8192 MB |
| CPU configuration (max) | 1 |
| Processor code | SLBMD |
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