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CN80617004122AG - Intel CORE I3-330M

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SKU: CN80617004122AG
Availability: In Stock
Weight: 1.00 LBS
Shipping: Calculated at Checkout
46C566DB-4644-460E-8DA7-038C0B9646AB E06A9D60-42A9-4459-8131-FA3002495928
Intel Core i3-330M. Processor family: Intel® Core™ i3, Processor socket: BGA 1288, Processor lithography: 32 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 8 GB, Memory types supported by processor: DDR3-SDRAM. On-board graphics card model: Intel® HD Graphics, On-board graphics card base frequency: 500 MHz, On-board graphics card dynamic frequency (max): 667 MHz. Market segment: Desktop, PCI Express configurations: 1x16, Number of Processing Die Transistors: 382 M. Processor package size: 37.5mm x 37.5mm; 34mm x 28mm

 

Specification:

 

Processor
Processor base frequency2.26 GHz
Processor manufacturerIntel
Cooler includedNo
Processor codenameArrandale
Memory bandwidth supported by processor (max)17.1 GB/s
Thermal Design Power (TDP)35 W
Processor cache3 MB
Processor ARK ID43529
Processor modeli3-350M
Processor threads4
System bus rate2.5 GT/s
Processor operating modes64-bit
SteppingC2
CPU multiplier (bus/core ratio)17
Bus typeDMI
Component forNotebook
Processor lithography32 nm
Processor family3rd gen Intel® Core™ i3
Processor cores2
BoxNo
Processor socketBGA 1288
Processor codeSLBPL
Processor seriesIntel Core i3-300 Mobile Series
Processor cache typeSmart Cache
Generation3rd Generation
Memory
Maximum internal memory supported by processor8 GB
Memory types supported by processorDDR3-SDRAM
Memory clock speeds supported by processor800,1066 MHz
Memory bandwidth supported by processor (max)17.1 GB/s
Supported memory typesDDR3-SDRAM
Memory channelsDual-channel
ECCNo
Graphics
Number of displays supported (on-board graphics)2
On-board graphics adapter modelIntel® HD Graphics
On-board graphics adapterYes
On-board graphics adapter dynamic frequency (max)667 MHz
On-board graphics adapter base frequency500 MHz
Power
Thermal Design Power (TDP)35 W
Technical details
Cache memory3 MB
Thermal Monitoring TechnologiesYes
Intel® Turbo Boost TechnologyNo
Intel Trusted Execution TechnologyNo
Intel® Smart CacheYes
Intel® Hyper Threading Technology (Intel® HT Technology)Yes
Intel Flex Memory AccessYes
Intel FDI TechnologyYes
Intel Fast Memory AccessYes
Intel Dual Display Capable TechnologyYes
Intel® Clear Video HD Technology (Intel® CVT HD)Yes
Intel® AES New Instructions (Intel® AES-NI)No
Idle StatesYes
Execute Disable BitYes
Enhanced Intel SpeedStep TechnologyYes
Intel® Virtualization Technology (Intel® VT)VT-x
PCI Express slots version2.0
PCI Express configurations1x16
Number of Processing Die Transistors382 M
Processing Die size81 mm²
Number of Graphics & IMC Die Transistors177 M
Graphics & IMC Die Size114 mm²
Supported instruction setsSSE4.1,SSE4.2
Intel VT-x with Extended Page Tables (EPT)Yes
Intel Enhanced Halt StateYes
Graphics & IMC lithography45 nm
Embedded options availableNo
CPU configuration (max)1
Bandwidth2.5 MB/s
Processor codeSLBPL
Product typeProcessor
Processor cache3072 KB
Intel Virtualization Technology for Directed I/O (VT-d)No
Intel 64Yes
Thermal Design Power (TDP)35 W
Supported memory typesDDR3-SDRAM
Intel® Clear Video Technology for Mobile Internet Devices (Intel CVT for MID)Yes
StatusDiscontinued
Product nameIntel Core i3-350M (3M Cache, 2.26 GHz)
Processor seriesIntel Core i3-300 Mobile Series
Physical Address Extension (PAE)36 bit
Market segmentMobile
Launch dateQ1'10
Intel Virtualization Technology (VT-x)Yes
Graphics max dynamic frequency667 MHz
Processor cache typeSmart Cache
Bus type unitsGT/s
Bus bandwidth2.5
Born on dateQ1'10
Maximum memory8 GB
Processor brand nameIntel Core i3
Last change63903513
Product familyPrevious Generation Intel Core i3 Processor
Bus speed2.5 GT/s
Features
Maximum number of PCI Express lanes16
Thermal Design Power (TDP)35 W
Processor package size37.5mm x 37.5mm; 34mm x 28mm
Processor ARK ID43529
Thermal Monitoring TechnologiesYes
Idle StatesYes
Execute Disable BitYes
PCI Express slots version2.0
PCI Express configurations1x16
Number of Processing Die Transistors382 M
Processing Die size81 mm²
Number of Graphics & IMC Die Transistors177 M
Graphics & IMC Die Size114 mm²
Supported instruction setsSSE4.1,SSE4.2
Graphics & IMC lithography45 nm
Embedded options availableNo
CPU configuration (max)1
Bandwidth2.5 MB/s
Processor codeSLBPL
Physical Address Extension (PAE)36 bit
Market segmentMobile
Harmonized System (HS) code8542310001
Export Control Classification Number (ECCN)3A991
Commodity Classification Automated Tracking System (CCATS)NA
PCI Express CEM revision2.0
Processor special features
Macrovision License RequiredNo
Intel Clear Video TechnologyYes
Intel Virtualization Technology for Directed I/O (VT-d)No
Intel 64Yes
Intel® Turbo Boost TechnologyNo
Intel Trusted Execution TechnologyNo
Intel® Smart CacheYes
Intel® Hyper Threading Technology (Intel® HT Technology)Yes
Intel Flex Memory AccessYes
Intel FDI TechnologyYes
Intel Fast Memory AccessYes
Intel Dual Display Capable TechnologyYes
Intel® Clear Video HD Technology (Intel® CVT HD)Yes
Intel® AES New Instructions (Intel® AES-NI)No
Enhanced Intel SpeedStep TechnologyYes
Intel® Virtualization Technology (Intel® VT)VT-x
Intel VT-x with Extended Page Tables (EPT)Yes
Intel Enhanced Halt StateYes
Intel® Clear Video Technology for Mobile Internet Devices (Intel CVT for MID)Yes
Intel Virtualization Technology (VT-x)Yes
Intel® vPro™ Platform EligibilityNo
Operational conditions
Tjunction105 °C
Weight & dimensions
Processor package size37.5mm x 37.5mm; 34mm x 28mm
Other features
Cache memory3 MB
Intel® Virtualization Technology (Intel® VT)VT-x
Maximum internal memory8 GB
Maximum internal memory8192 MB
CPU configuration (max)1
Processor codeSLBPL

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