CM8070104291907 - Intel PENTIUM G6400T 3.40GHZ 4M, TRAY
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CM8070104291907 - Intel PENTIUM G6400T 3.40GHZ 4M, TRAY
$206.86
$114.92
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$91.94
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SKU:
CM8070104291907
Availability:
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Weight:
1.00 LBS
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Intel Pentium Gold G6400T. Processor family: Intel® Pentium® Gold, Processor socket: LGA 1200 (Socket H5), Processor lithography: 14 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 128 GB, Memory types supported by processor: DDR4-SDRAM. On-board graphics card model: Intel® UHD Graphics 610, Maximum on-board graphics card memory: 64 GB, On-board graphics card base frequency: 350 MHz. Market segment: Desktop, PCI Express configurations: 1x16, 2x8, 1x8+2x4, Supported instruction sets: SSE4.1, SSE4.2. Processor package size: 37.5 x 37.5 mm
Specification:
| Processor | |
|---|---|
| Processor base frequency | 3.5 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Comet Lake |
| Configurable TDP-down | 25 W |
| Memory bandwidth supported by processor (max) | 41.6 GB/s |
| Thermal Design Power (TDP) | 35 W |
| Processor cache | 4 MB |
| Processor ARK ID | 201900 |
| Processor model | G6405T |
| Processor threads | 4 |
| System bus rate | 8 GT/s |
| Processor operating modes | 64-bit |
| Component for | PC |
| Processor lithography | 14 nm |
| Processor family | Intel® Pentium® Gold |
| Processor cores | 2 |
| Box | No |
| Processor socket | LGA 1200 (Socket H5) |
| Configurable TDP-down frequency | 2.3 GHz |
| Processor cache type | Smart Cache |
| Memory | |
| Maximum internal memory supported by processor | 128 GB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2666 MHz |
| Memory bandwidth supported by processor (max) | 41.6 GB/s |
| Supported memory types | DDR4-SDRAM |
| Memory channels | Dual-channel |
| Memory bandwidth (max) | 41.6 GB/s |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card maximum resolution (DisplayPort) | 4096 x 2304 pixels |
| On-board graphics card maximum resolution (eDP - Integrated Flat Panel) | 4096 x 2304 pixels |
| On-board graphics card 4K support | Yes |
| On-board graphics card refresh rate at maximum resolution (HDMI) | 30 Hz |
| On-board graphics card refresh rate at maximum resolution (DisplayPort) | 60 Hz |
| On-board graphics card refresh rate at maximum resolution (eDP - Integrated Flat Panel) | 60 Hz |
| Maximum on-board graphics card memory | 64 GB |
| On-board graphics card maximum resolution (HDMI) | 4096 x 2160 pixels |
| On-board graphics card OpenGL version | 4.5 |
| On-board graphics card model | Intel® UHD Graphics 610 |
| On-board graphics card | Yes |
| On-board graphics card dynamic frequency (max) | 1050 MHz |
| On-board graphics card base frequency | 350 MHz |
| Discrete graphics card model | Not available |
| Power | |
| Configurable TDP-down | 25 W |
| Thermal Design Power (TDP) | 35 W |
| Configurable TDP-down frequency | 2.3 GHz |
| Technical details | |
| Intel Stable Image Platform Program (SIPP) | No |
| Thermal solution specification | PCG 2015B |
| Intel® Secure Key | Yes |
| Thermal Monitoring Technologies | Yes |
| Intel® Turbo Boost Technology | No |
| Intel Trusted Execution Technology | No |
| Intel® Quick Sync Video Technology | Yes |
| Intel® InTru™ 3D Technology | Yes |
| Intel® Identity Protection Technology (Intel® IPT) | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® Clear Video HD Technology (Intel® CVT HD) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| PCI Express slots version | 3.0 |
| PCI Express configurations | 1x16, 2x8, 1x8+2x4 |
| Supported instruction sets | SSE4.1, SSE4.2 |
| Scalability | 1S |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| CPU configuration (max) | 1 |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 35 W |
| Supported memory types | DDR4-SDRAM |
| Status | Launched |
| Market segment | Desktop |
| Launch date | Q1'21 |
| Intel Virtualization Technology (VT-x) | Yes |
| Configurable TDP-down frequency | 2.3 GHz |
| Processor cache type | Smart Cache |
| Features | |
| Maximum number of PCI Express lanes | 16 |
| Thermal Design Power (TDP) | 35 W |
| Processor package size | 37.5 x 37.5 mm |
| Processor ARK ID | 201900 |
| Thermal solution specification | PCG 2015B |
| Thermal Monitoring Technologies | Yes |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| PCI Express slots version | 3.0 |
| PCI Express configurations | 1x16, 2x8, 1x8+2x4 |
| Supported instruction sets | SSE4.1, SSE4.2 |
| Scalability | 1S |
| CPU configuration (max) | 1 |
| Market segment | Desktop |
| Harmonized System (HS) code | 8542310001 |
| Export Control Classification Number (ECCN) | 5A992C |
| Commodity Classification Automated Tracking System (CCATS) | G077159 |
| Use conditions | PC/Client/Tablet |
| Processor special features | |
| Intel Clear Video Technology | Yes |
| Intel Software Guard Extensions (Intel SGX) | Yes |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Intel Turbo Boost Max Technology 3.0 | No |
| Intel® Optane™ Memory Ready | Yes |
| Intel® OS Guard | Yes |
| Intel Stable Image Platform Program (SIPP) | No |
| Intel® Secure Key | Yes |
| Intel® Turbo Boost Technology | No |
| Intel Trusted Execution Technology | No |
| Intel® Quick Sync Video Technology | Yes |
| Intel® InTru™ 3D Technology | Yes |
| Intel® Identity Protection Technology (Intel® IPT) | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® Clear Video HD Technology (Intel® CVT HD) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| Intel® Boot Guard | Yes |
| Intel® Thermal Velocity Boost | No |
| Intel® vPro™ Platform Eligibility | No |
| Intel® Transactional Synchronization Extensions | No |
| Operational conditions | |
| Tjunction | 100 °C |
| Weight & dimensions | |
| Processor package size | 37.5 x 37.5 mm |
| Other features | |
| Maximum internal memory | 128 GB |
| CPU configuration (max) | 1 |
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