Specification:
Processor | |
---|---|
Processor generation | 10th gen Intel® Core™ i9 |
Processor base frequency | 3.5 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Cascade Lake |
Memory bandwidth supported by processor (max) | 94 GB/s |
Thermal Design Power (TDP) | 165 W |
Processor cache | 19.25 MB |
Processor ARK ID | 198012 |
Processor model | i9-10920X |
Processor threads | 24 |
System bus rate | 8 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 4.6 GHz |
Component for | PC |
Processor lithography | 14 nm |
Processor family | Intel® Core™ i9 X-series |
Processor cores | 12 |
Box | No |
Processor socket | LGA 2066 (Socket R4) |
Processor cache type | Smart Cache |
Generation | 10th Generation |
Memory | |
Maximum internal memory supported by processor | 256 GB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2933 MHz |
Memory bandwidth supported by processor (max) | 94 GB/s |
Supported memory types | DDR4-SDRAM |
Memory channels | Quad-channel |
ECC | No |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 165 W |
Technical details | |
Thermal solution specification | PCG 2017X |
Intel® Turbo Boost Technology | 2.0 |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Execute Disable Bit | Yes |
Enhanced Intel SpeedStep Technology | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | SSE4.1, SSE4.2, AVX 2.0, AVX-512 |
Scalability | 1S |
Embedded options available | No |
CPU configuration (max) | 1 |
Product type | Processor |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 165 W |
Supported memory types | DDR4-SDRAM |
Status | Launched |
Market segment | Desktop |
Launch date | Q4'19 |
Intel Virtualization Technology (VT-x) | Yes |
Processor cache type | Smart Cache |
Maximum memory | 256 GB |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Bus speed | 8 GT/s DMI3 |
Target market | Gaming, Content Creation |
Features | |
Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 165 W |
Processor ARK ID | 198012 |
Thermal solution specification | PCG 2017X |
Execute Disable Bit | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | SSE4.1, SSE4.2, AVX 2.0, AVX-512 |
Scalability | 1S |
Embedded options available | No |
CPU configuration (max) | 1 |
Market segment | Desktop |
Harmonized System (HS) code | 85423119 |
Export Control Classification Number (ECCN) | 5A992C |
Commodity Classification Automated Tracking System (CCATS) | G077159 |
PCI Express CEM revision | 3.0 |
Processor special features | |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel Turbo Boost Max Technology 3.0 | Yes |
Intel® Optane™ Memory Ready | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Enhanced Intel SpeedStep Technology | Yes |
Intel Virtualization Technology (VT-x) | Yes |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
Intel® Turbo Boost Max Technology 3.0 frequency | 4.8 GHz |
Operational conditions | |
Tjunction | 94 °C |
Packaging data | |
Package width | 1.73" (44 mm) |
Package depth | 4.57" (116 mm) |
Package height | 3.98" (101 mm) |
Package weight | 3.07 oz (87 g) |
Package type | Retail box |
Weight & dimensions | |
Package width | 1.73" (44 mm) |
Package depth | 4.57" (116 mm) |
Package height | 3.98" (101 mm) |
Package weight | 3.07 oz (87 g) |
Other features | |
Maximum internal memory | 256 GB |
CPU configuration (max) | 1 |