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CD8069504201101 - Intel SVRWS XP CASCADE LAKE-SP 8260

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SKU: CD8069504201101
Availability: In Stock
Weight: 1.00 LBS
Shipping: Calculated at Checkout
46C566DB-4644-460E-8DA7-038C0B9646AB E06A9D60-42A9-4459-8131-FA3002495928
Intel Xeon 8260. Processor family: Intel® Xeon® Platinum, Processor socket: FCLGA3647, Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 1024 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: SSE4.2, AVX, AVX 2.0, AVX-512, Scalability: S8S. Processor package size: 76mm x 56.5mm. Maximum internal memory: 1000 GB

 

Specification:

 

Processor
Processor base frequency2.4 GHz
Processor manufacturerIntel
Cooler includedNo
Processor codenameCascade Lake
Thermal Design Power (TDP)165 W
Processor cache35.75 MB
Processor ARK ID192477
Processor model8260M
Processor threads48
Processor operating modes64-bit
Processor boost frequency3.9 GHz
Component forServer/workstation
Processor lithography14 nm
Processor familyIntel® Xeon® Platinum
Processor cores24
BoxNo
Processor socketLGA 3647 (Socket P)
Memory
Maximum internal memory supported by processor2048 GB
Memory types supported by processorDDR4-SDRAM
Memory clock speeds supported by processor2933 MHz
Memory channelsHexa-channel
ECCYes
Graphics
Discrete graphics cardNo
On-board graphics card modelNot available
On-board graphics cardNo
Discrete graphics card modelNot available
Power
Thermal Design Power (TDP)165 W
Technical details
Intel TSX-NIYes
Intel® Turbo Boost Technology2.0
Intel Trusted Execution TechnologyYes
Intel® Hyper Threading Technology (Intel® HT Technology)Yes
Intel® AES New Instructions (Intel® AES-NI)Yes
Execute Disable BitYes
Enhanced Intel SpeedStep TechnologyYes
PCI Express slots version3.0
Supported instruction setsAVX-512
ScalabilityS8S
Intel VT-x with Extended Page Tables (EPT)Yes
Embedded options availableNo
Product typeProcessor
Intel Virtualization Technology for Directed I/O (VT-d)Yes
Intel 64Yes
Thermal Design Power (TDP)165 W
StatusLaunched
Market segmentServer
Launch dateQ2'19
Intel Virtualization Technology (VT-x)Yes
Number of UPI links3
Memory speed (max)2933 MHz
AVX-512 Fused Multiply-Add (FMA) units2
Features
Maximum number of PCI Express lanes48
Thermal Design Power (TDP)165 W
Processor package size76.0 x 56.5 mm
Processor ARK ID192477
Execute Disable BitYes
PCI Express slots version3.0
Supported instruction setsAVX-512
ScalabilityS8S
Embedded options availableNo
Market segmentServer
Harmonized System (HS) code85423119
PCI Express CEM revision3.0
Processor special features
Intel Virtualization Technology for Directed I/O (VT-d)Yes
Intel 64Yes
Intel Turbo Boost Max Technology 3.0No
Intel® Speed Shift TechnologyYes
Intel TSX-NIYes
Intel® Turbo Boost Technology2.0
Intel Trusted Execution TechnologyYes
Intel® Hyper Threading Technology (Intel® HT Technology)Yes
Intel® AES New Instructions (Intel® AES-NI)Yes
Enhanced Intel SpeedStep TechnologyYes
Intel VT-x with Extended Page Tables (EPT)Yes
Intel Virtualization Technology (VT-x)Yes
AVX-512 Fused Multiply-Add (FMA) units2
Intel® Volume Management Device (VMD)Yes
Intel® Speed Select technology - Performance Profile (Intel® SST-PP)No
Intel® Optane™ DC Persistent Memory SupportedYes
Intel® Deep Learning Boost (Intel® DL Boost)Yes
Mode-based Execute Control (MBE)Yes
Intel® Run Sure TechnologyYes
Intel® Resource Director Technology (Intel® RDT)Yes
Intel® vPro™ Platform EligibilityYes
Intel® Speed Select Technology - Base Frequency (Intel® SST-BF)No
Intel® Optane™ DC Persistent Memory technologyYes
Intel Speed Select Technology (SST)No
Operational conditions
Tcase90 °C
Weight & dimensions
Processor package size76.0 x 56.5 mm

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