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CD8068904599101 - Intel XEON PLAT 8358P PROC 48M CACHE

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SKU: CD8068904599101
Availability: In Stock
Weight: 1.00 LBS
Shipping: Calculated at Checkout
46C566DB-4644-460E-8DA7-038C0B9646AB E06A9D60-42A9-4459-8131-FA3002495928
Intel Xeon Platinum 8358P. Processor family: Intel® Xeon® Platinum, Processor socket: FCLGA4189, Processor lithography: 10 nm. Memory channels: Octa-channel, Maximum internal memory supported by processor: 6144 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: SSE4.2, AVX, AVX 2.0, AVX-512, Scalability: 2S. Maximum Enclave Size Support for Intel® SGX: 8 GB. Processor package size: 77.5 x 56.5 mm

 

Specification:

 

Processor
Processor generation3rd Generation Intel® Xeon® Scalable
Processor base frequency2.2 GHz
Processor manufacturerIntel
Cooler includedNo
Processor codenameIce Lake
Thermal Design Power (TDP)205 W
Processor cache48 MB
Processor ARK ID212307
Processor model8352S
Processor threads64
System bus rate11.2 GT/s
Processor operating modes64-bit
Processor boost frequency3.4 GHz
Component forServer/workstation
Processor lithography10 nm
Processor familyIntel® Xeon® Platinum
Processor cores32
BoxNo
Processor socketFCLGA4189
High priority cores12
High priority core frequency2.4 GHz
Low priority cores20
Low priority core frequency2 GHz
Memory
Maximum internal memory supported by processor6144 GB
Memory types supported by processorDDR4-SDRAM
Memory clock speeds supported by processor3200 MHz
Supported memory typesDDR4-SDRAM
Memory channelsOcta-channel
ECCYes
Graphics
Discrete graphics cardNo
On-board graphics card modelNot available
On-board graphics cardNo
Discrete graphics card modelNot available
Power
Thermal Design Power (TDP)205 W
Technical details
Intel® Turbo Boost Technology2.0
Intel Trusted Execution TechnologyYes
Intel® Hyper Threading Technology (Intel® HT Technology)Yes
Intel® AES New Instructions (Intel® AES-NI)Yes
Execute Disable BitYes
PCI Express slots version4.0
Supported instruction setsSSE4.2, AVX, AVX 2.0, AVX-512
Scalability2S
Intel VT-x with Extended Page Tables (EPT)Yes
Embedded options availableNo
Intel Virtualization Technology for Directed I/O (VT-d)Yes
Intel 64Yes
Thermal Design Power (TDP)205 W
Supported memory typesDDR4-SDRAM
StatusLaunched
Market segmentServer
Launch dateQ2'21
Intel Virtualization Technology (VT-x)Yes
Number of UPI links3
Memory speed (max)3200 MHz
AVX-512 Fused Multiply-Add (FMA) units2
Target marketCloud Computing
Features
Maximum number of PCI Express lanes64
Thermal Design Power (TDP)205 W
Processor package size77.5 x 56.5 mm
Processor ARK ID212307
Execute Disable BitYes
PCI Express slots version4.0
Supported instruction setsSSE4.2, AVX, AVX 2.0, AVX-512
Scalability2S
Embedded options availableNo
Market segmentServer
Harmonized System (HS) code85423119
Export Control Classification Number (ECCN)5A992CN3
Commodity Classification Automated Tracking System (CCATS)G178966
Processor special features
Intel Software Guard Extensions (Intel SGX)Yes
Intel Virtualization Technology for Directed I/O (VT-d)Yes
Intel 64Yes
Intel® Speed Shift TechnologyYes
Intel® Optane™ Memory ReadyYes
Intel® Turbo Boost Technology2.0
Intel Trusted Execution TechnologyYes
Intel® Hyper Threading Technology (Intel® HT Technology)Yes
Intel® AES New Instructions (Intel® AES-NI)Yes
Intel VT-x with Extended Page Tables (EPT)Yes
Intel Virtualization Technology (VT-x)Yes
AVX-512 Fused Multiply-Add (FMA) units2
Intel® Volume Management Device (VMD)Yes
Intel® Speed Select technology - Performance Profile (Intel® SST-PP)Yes
Intel® Optane™ DC Persistent Memory SupportedYes
Intel® Deep Learning Boost (Intel® DL Boost)Yes
Mode-based Execute Control (MBE)Yes
Intel® Run Sure TechnologyYes
Intel® Resource Director Technology (Intel® RDT)Yes
Intel® Transactional Synchronization ExtensionsYes
Intel® Total Memory EncryptionYes
Maximum Enclave Size Support for Intel® SGX512 GB
Intel® Platform Firmware Resilience SupportYes
Intel® Crypto AccelerationYes
Operational conditions
Tcase81 °C
Logistics data
Harmonized System (HS) code85423119
Weight & dimensions
Processor package size77.5 x 56.5 mm
Other features
Maximum internal memory6000 GB

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