Specification:
Processor | |
---|---|
Processor generation | 3rd Generation Intel® Xeon® Scalable |
Processor base frequency | 2.2 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Ice Lake |
Thermal Design Power (TDP) | 205 W |
Processor cache | 48 MB |
Processor ARK ID | 212307 |
Processor model | 8352S |
Processor threads | 64 |
System bus rate | 11.2 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 3.4 GHz |
Component for | Server/workstation |
Processor lithography | 10 nm |
Processor family | Intel® Xeon® Platinum |
Processor cores | 32 |
Box | No |
Processor socket | FCLGA4189 |
High priority cores | 12 |
High priority core frequency | 2.4 GHz |
Low priority cores | 20 |
Low priority core frequency | 2 GHz |
Memory | |
Maximum internal memory supported by processor | 6144 GB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 3200 MHz |
Supported memory types | DDR4-SDRAM |
Memory channels | Octa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 205 W |
Technical details | |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Execute Disable Bit | Yes |
PCI Express slots version | 4.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Embedded options available | No |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 205 W |
Supported memory types | DDR4-SDRAM |
Status | Launched |
Market segment | Server |
Launch date | Q2'21 |
Intel Virtualization Technology (VT-x) | Yes |
Number of UPI links | 3 |
Memory speed (max) | 3200 MHz |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Target market | Cloud Computing |
Features | |
Maximum number of PCI Express lanes | 64 |
Thermal Design Power (TDP) | 205 W |
Processor package size | 77.5 x 56.5 mm |
Processor ARK ID | 212307 |
Execute Disable Bit | Yes |
PCI Express slots version | 4.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Embedded options available | No |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Export Control Classification Number (ECCN) | 5A992CN3 |
Commodity Classification Automated Tracking System (CCATS) | G178966 |
Processor special features | |
Intel Software Guard Extensions (Intel SGX) | Yes |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel® Speed Shift Technology | Yes |
Intel® Optane™ Memory Ready | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Intel® Volume Management Device (VMD) | Yes |
Intel® Speed Select technology - Performance Profile (Intel® SST-PP) | Yes |
Intel® Optane™ DC Persistent Memory Supported | Yes |
Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
Mode-based Execute Control (MBE) | Yes |
Intel® Run Sure Technology | Yes |
Intel® Resource Director Technology (Intel® RDT) | Yes |
Intel® Transactional Synchronization Extensions | Yes |
Intel® Total Memory Encryption | Yes |
Maximum Enclave Size Support for Intel® SGX | 512 GB |
Intel® Platform Firmware Resilience Support | Yes |
Intel® Crypto Acceleration | Yes |
Operational conditions | |
Tcase | 81 °C |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Weight & dimensions | |
Processor package size | 77.5 x 56.5 mm |
Other features | |
Maximum internal memory | 6000 GB |