Specification:
Processor | |
---|---|
Processor base frequency | 3.1 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Thermal Design Power (TDP) | 255 W |
Processor cache | 38.5 MB |
Processor ARK ID | 189452 |
Processor model | W-3175X |
Processor threads | 56 |
System bus rate | 8 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 3.8 GHz |
Component for | PC |
Processor lithography | 14 nm |
Processor family | Intel® Xeon® |
Processor cores | 28 |
Box | No |
Processor socket | LGA 3647 (Socket P) |
Processor cache type | Smart Cache |
Memory | |
Maximum internal memory supported by processor | 512 GB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2666 MHz |
Memory channels | Hexa-channel |
ECC | Yes |
Power | |
Thermal Design Power (TDP) | 255 W |
Technical details | |
Intel TSX-NI | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Enhanced Intel SpeedStep Technology | Yes |
Supported instruction sets | AVX,AVX 2.0,AVX-512,SSE4.2 |
Scalability | 1S |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Embedded options available | No |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 255 W |
Market segment | Desktop |
Intel Virtualization Technology (VT-x) | Yes |
Processor cache type | Smart Cache |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Features | |
Thermal Design Power (TDP) | 255 W |
Processor package size | 76 x 56.5 mm |
Processor ARK ID | 189452 |
Supported instruction sets | AVX,AVX 2.0,AVX-512,SSE4.2 |
Scalability | 1S |
Embedded options available | No |
Market segment | Desktop |
Processor special features | |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel Turbo Boost Max Technology 3.0 | No |
Intel® Speed Shift Technology | Yes |
Intel® Optane™ Memory Ready | No |
Intel TSX-NI | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Enhanced Intel SpeedStep Technology | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Intel® vPro™ Platform Eligibility | Yes |
Operational conditions | |
Tjunction | 85 °C |
Tcase | 70 °C |
Weight & dimensions | |
Processor package size | 76 x 56.5 mm |