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BX806955218 - Intel BOXED INTEL XEON GOLD 5218 PROCESSOR

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SKU: BX806955218
Availability: In Stock
Weight: 1.00 LBS
Shipping: Calculated at Checkout
46C566DB-4644-460E-8DA7-038C0B9646AB E06A9D60-42A9-4459-8131-FA3002495928
Intel Xeon 5218. Processor family: Intel® Xeon® Gold, Processor socket: FCLGA3647, Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 1024 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: SSE4.2, AVX, AVX 2.0, AVX-512, Scalability: 4S. Package type: Retail box. Processor package size: 76mm x 56.5mm

 

Specification:

 

Processor
Processor generation2nd Generation Intel® Xeon® Scalable
Processor base frequency2.1 GHz
Processor manufacturerIntel
Cooler includedYes
Processor codenameCascade Lake
Thermal Design Power (TDP)125 W
Processor cache27.5 MB
Processor ARK ID199342
Processor model5218R
Processor threads40
Processor operating modes64-bit
Processor boost frequency4 GHz
Component forServer/workstation
Processor lithography14 nm
Processor familyIntel® Xeon® Gold
Processor cores20
BoxYes
Processor socketFCLGA3647
Memory
Maximum internal memory supported by processor1024 GB
Memory types supported by processorDDR4-SDRAM
Memory clock speeds supported by processor2667 MHz
Supported memory typesDDR4-SDRAM
Memory channelsHexa-channel
ECCYes
Graphics
Discrete graphics cardNo
On-board graphics card modelNot available
On-board graphics cardNo
Discrete graphics card modelNot available
Power
Thermal Design Power (TDP)125 W
Technical details
Intel® Turbo Boost Technology2.0
Intel Trusted Execution TechnologyYes
Intel® Hyper Threading Technology (Intel® HT Technology)Yes
Intel® AES New Instructions (Intel® AES-NI)Yes
Execute Disable BitYes
Enhanced Intel SpeedStep TechnologyYes
PCI Express slots version3.0
Supported instruction setsSSE4.2, AVX, AVX 2.0, AVX-512
Scalability2S
Intel VT-x with Extended Page Tables (EPT)Yes
Embedded options availableNo
Product typeProcessor
Intel Virtualization Technology for Directed I/O (VT-d)Yes
Intel 64Yes
Thermal Design Power (TDP)125 W
Supported memory typesDDR4-SDRAM
StatusLaunched
Market segmentServer
Launch dateQ1'20
Intel Virtualization Technology (VT-x)Yes
Number of UPI links2
Memory speed (max)2667 MHz
AVX-512 Fused Multiply-Add (FMA) units1
Features
Maximum number of PCI Express lanes48
Thermal Design Power (TDP)125 W
Processor package size76mm x 56.5mm
Processor ARK ID199342
Execute Disable BitYes
PCI Express slots version3.0
Supported instruction setsSSE4.2, AVX, AVX 2.0, AVX-512
Scalability2S
Embedded options availableNo
Market segmentServer
Harmonized System (HS) code85423119
Export Control Classification Number (ECCN)5A992C
Commodity Classification Automated Tracking System (CCATS)G077159
PCI Express CEM revision3.0
Processor special features
Intel Virtualization Technology for Directed I/O (VT-d)Yes
Intel 64Yes
Intel Turbo Boost Max Technology 3.0No
Intel® Speed Shift TechnologyYes
Intel® Turbo Boost Technology2.0
Intel Trusted Execution TechnologyYes
Intel® Hyper Threading Technology (Intel® HT Technology)Yes
Intel® AES New Instructions (Intel® AES-NI)Yes
Enhanced Intel SpeedStep TechnologyYes
Intel VT-x with Extended Page Tables (EPT)Yes
Intel Virtualization Technology (VT-x)Yes
AVX-512 Fused Multiply-Add (FMA) units1
Intel® Volume Management Device (VMD)Yes
Intel® Speed Select technology - Performance Profile (Intel® SST-PP)No
Intel® Optane™ DC Persistent Memory SupportedYes
Intel® Deep Learning Boost (Intel® DL Boost)Yes
Mode-based Execute Control (MBE)Yes
Intel® Run Sure TechnologyYes
Intel® Resource Director Technology (Intel® RDT)Yes
Intel® vPro™ Platform EligibilityYes
Intel® Speed Select Technology - Base Frequency (Intel® SST-BF)No
Intel® Optane™ DC Persistent Memory technologyYes
Intel Speed Select Technology (SST)No
Intel® Transactional Synchronization ExtensionsYes
Operational conditions
Tcase87 °C
Packaging data
Package width1.69" (43 mm)
Package depth5.39" (137 mm)
Package height4.41" (112 mm)
Package typeRetail box
Logistics data
Harmonized System (HS) code85423119
Weight & dimensions
Processor package size76mm x 56.5mm
Package width1.69" (43 mm)
Package depth5.39" (137 mm)
Package height4.41" (112 mm)
Other features
Maximum internal memory1000 GB

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