BX80673I97900X - Intel I9-7900X 4.30GHZ 13.75MB 140W

Intel Core i9-7900X. Processor family: Intel® Core™ i9 X-series, Processor socket: LGA 2066 (Socket R4), Processor lithography: 14 nm. Memory channels: Quad-channel, Maximum internal memory supported by processor: 128 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Desktop, Supported instruction sets: SSE4.1,SSE4.2,AVX 2.0,AVX-512, Scalability: 1S. Intel® Turbo Boost Max Technology 3.0 frequency: 4.5 GHz. Package width: 1.73" (44 mm), Package depth: 4.57" (116 mm), Package height: 3.98" (101 mm)

 

Specification:

 

Processor
Processor generation	7th gen Intel® Core™ i9
Processor base frequency	2.9 GHz
Processor manufacturer	Intel
Cooler included	No
Processor codename	Skylake
Memory bandwidth supported by processor (max)	85 GB/s
Thermal Design Power (TDP)	140 W
Processor cache	16.5 MB
Processor ARK ID	126240
Processor model	i9-7920X
Processor threads	24
System bus rate	8 GT/s
Processor operating modes	64-bit
Compatible chipsets	Intel® X299
Processor boost frequency	4.3 GHz
Bus type	DMI
Component for	PC
Processor lithography	14 nm
Processor family	Intel® Core™ i9 X-series
Processor cores	12
Box	Yes
Processor socket	LGA 2066 (Socket R4)
Processor series	Intel® Core™ X-series
Processor cache type	L3
Generation	7th Generation
Memory
Maximum internal memory supported by processor	128 GB
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	2666 MHz
Memory bandwidth supported by processor (max)	85 GB/s
Memory voltage supported by processor	1.2 V
Supported memory types	DDR4-SDRAM
Memory channels	Quad-channel
ECC	No
Power
Thermal Design Power (TDP)	140 W
Technical details
Thermal solution specification	PCG 2017X
Intel® Turbo Boost Technology	2.0
Intel® Hyper Threading Technology (Intel® HT Technology)	Yes
Intel® AES New Instructions (Intel® AES-NI)	Yes
Execute Disable Bit	Yes
Enhanced Intel SpeedStep Technology	Yes
PCI Express slots version	3.0
Supported instruction sets	SSE4.1, SSE4.2, AVX 2.0, AVX-512
Scalability	1S
Embedded options available	No
CPU configuration (max)	1
Product type	Processor
Processor cache	16896 KB
Intel Virtualization Technology for Directed I/O (VT-d)	Yes
Intel 64	Yes
Thermal Design Power (TDP)	140 W
Supported memory types	DDR4-SDRAM
Status	Discontinued
Processor series	Intel® Core™ X-series
Market segment	Desktop
Launch date	Q3'17
Intel Virtualization Technology (VT-x)	Yes
Processor cache type	L3
Bus type units	GT/s
Bus bandwidth	8
Maximum memory	128 GB
Processor brand name	Intel Core i7 X-series Intel Core i7 X-series processor
Last change	63903513
Product family	Intel Core Processors
Intel Turbo Boost Max Technology frequency	4400 MHz
AVX-512 Fused Multiply-Add (FMA) units	2
Bus speed	8 GT/s
Features
Maximum number of PCI Express lanes	44
Thermal Design Power (TDP)	140 W
Processor package size	52.5 x 45 mm
Processor ARK ID	126240
Thermal solution specification	PCG 2017X
Execute Disable Bit	Yes
PCI Express slots version	3.0
Supported instruction sets	SSE4.1, SSE4.2, AVX 2.0, AVX-512
Scalability	1S
Embedded options available	No
CPU configuration (max)	1
Market segment	Desktop
Harmonized System (HS) code	8542310001
Export Control Classification Number (ECCN)	5A992C
Commodity Classification Automated Tracking System (CCATS)	G077159
PCI Express CEM revision	3.0
Processor special features
Intel Virtualization Technology for Directed I/O (VT-d)	Yes
Intel 64	Yes
Conflict-Free processor	Yes
Intel Turbo Boost Max Technology 3.0	Yes
Intel® Optane™ Memory Ready	Yes
Virtual Reality (VR) ready	Yes
Intel® Turbo Boost Technology	2.0
Intel® Hyper Threading Technology (Intel® HT Technology)	Yes
Intel® AES New Instructions (Intel® AES-NI)	Yes
Enhanced Intel SpeedStep Technology	Yes
Intel Virtualization Technology (VT-x)	Yes
AVX-512 Fused Multiply-Add (FMA) units	2
Intel® Turbo Boost Max Technology 3.0 frequency	4.4 GHz
Operational conditions
Tjunction	95 °C
Packaging data
Package width	1.73" (44 mm)
Package depth	4.57" (116 mm)
Package height	3.98" (101 mm)
Package weight	3.53 oz (100 g)
Package type	Retail box
Logistics data
Harmonized System (HS) code	8542310001
Weight & dimensions
Processor package size	52.5 x 45 mm
Package width	1.73" (44 mm)
Package depth	4.57" (116 mm)
Package height	3.98" (101 mm)
Package weight	3.53 oz (100 g)
Other features
Maximum internal memory	128 GB
Maximum internal memory	131072 MB
CPU configuration (max)	1