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BX80646E31230V3 - Intel E3-1230V3 3.30G 4C 80W PROC

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SKU: BX80646E31230V3
Availability: In Stock
Weight: 1.00 LBS
Shipping: Calculated at Checkout
46C566DB-4644-460E-8DA7-038C0B9646AB E06A9D60-42A9-4459-8131-FA3002495928
Intel Xeon E3-1230 v3. Processor family: Intel® Xeon® E3 V3 Family, Processor socket: LGA 1150 (Socket H3), Processor lithography: 22 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 32 GB, Memory types supported by processor: DDR3-SDRAM, DDR3L-SDRAM. Market segment: Server, PCI Express configurations: 1x16, 2x8, 1x8+2x4, Supported instruction sets: SSE4.1, SSE4.2, AVX 2.0. Intel® Turbo Boost Technology 2.0 frequency: 3.7 GHz. Package width: 2.76" (70 mm), Package depth: 4.57" (116 mm), Package height: 3.98" (101 mm)

 

Specification:

 

Processor
Processor base frequency3.4 GHz
Processor manufacturerIntel
Cooler includedYes
Processor codenameHaswell
Memory bandwidth supported by processor (max)25.6 GB/s
Thermal Design Power (TDP)80 W
Processor cache8 MB
Processor ARK ID80910
Processor modelE3-1231V3
Processor threads8
System bus rate5 GT/s
Processor operating modes64-bit
Processor boost frequency3.8 GHz
SteppingC0
Bus typeDMI2
Component forServer/workstation
Processor lithography22 nm
Processor familyIntel® Xeon® E3 V3 Family
Processor cores4
BoxYes
Processor socketLGA 1150 (Socket H3)
Processor seriesIntel Xeon E3-1200 v3
Processor cache typeSmart Cache
Memory
Maximum internal memory supported by processor32 GB
Memory types supported by processorDDR3-SDRAM, DDR3L-SDRAM
Memory clock speeds supported by processor1333,1600 MHz
Memory bandwidth supported by processor (max)25.6 GB/s
Supported memory typesDDR3-SDRAM, DDR3L-SDRAM
Memory channelsDual-channel
ECCYes
Graphics
On-board graphics card modelNot available
On-board graphics cardNo
Power
Thermal Design Power (TDP)80 W
Technical details
Intel Stable Image Platform Program (SIPP)Yes
Cache memory8 MB
Thermal solution specificationPCG 2013D
Intel TSX-NIYes
Intel® Secure KeyYes
Thermal Monitoring TechnologiesYes
Intel® Turbo Boost Technology2.0
Intel Trusted Execution TechnologyYes
Intel® Smart CacheYes
Intel® My WiFi Technology (Intel® MWT)No
Intel® Identity Protection Technology (Intel® IPT)Yes
Intel I/O Acceleration TechnologyYes
Intel® Hyper Threading Technology (Intel® HT Technology)Yes
Intel Flex Memory AccessYes
Intel Fast Memory AccessYes
Intel® Anti-Theft Technology (Intel® AT)Yes
Intel® AES New Instructions (Intel® AES-NI)Yes
Idle StatesYes
Execute Disable BitYes
Enhanced Intel SpeedStep TechnologyYes
Intel® Virtualization Technology (Intel® VT)VT-d, VT-x
PCI Express slots version3.0
PCI Express configurations1x16, 2x8, 1x8+2x4
Supported instruction setsSSE4.1, SSE4.2, AVX 2.0
Scalability1S
Intel VT-x with Extended Page Tables (EPT)Yes
Intel Enhanced Halt StateYes
Graphics & IMC lithography22 nm
Embedded options availableNo
CPU configuration (max)1
Product typeProcessor
Processor cache8192 KB
Intel Virtualization Technology for Directed I/O (VT-d)Yes
Intel 64Yes
Thermal Design Power (TDP)80 W
Supported memory typesDDR3-SDRAM, DDR3L-SDRAM
StatusDiscontinued
Product nameIntel Xeon E3-1231 v3 (8M Cache, 3.40 GHz)
Processor seriesIntel Xeon E3-1200 v3
Market segmentServer
Launch dateQ2'14
Intel Virtualization Technology (VT-x)Yes
Intel Stable Image Platform Program (SIPP) version1.00
Intel Secure Key Technology version1.00
Intel Identity Protection Technology version1.00
Processor cache typeSmart Cache
Bus type unitsGT/s
Bus bandwidth5
Born on dateQ2'14
Maximum memory32 GB
Intel TSX-NI version1.00
Processor brand nameIntel Xeon v2
Last change63903513
Product familyIntel Xeon Processor E3 v3 Family
Bus speed5 GT/s
Features
Maximum number of PCI Express lanes16
Thermal Design Power (TDP)80 W
Processor package size37.5 x 37.5 mm
Processor ARK ID80910
Thermal solution specificationPCG 2013D
Thermal Monitoring TechnologiesYes
Idle StatesYes
Execute Disable BitYes
PCI Express slots version3.0
PCI Express configurations1x16, 2x8, 1x8+2x4
Supported instruction setsSSE4.1, SSE4.2, AVX 2.0
Scalability1S
Graphics & IMC lithography22 nm
Embedded options availableNo
CPU configuration (max)1
Market segmentServer
Harmonized System (HS) code8542310001
Export Control Classification Number (ECCN)5A992C
Commodity Classification Automated Tracking System (CCATS)G077159
PCI Express CEM revision3.0
Processor special features
Intel Virtualization Technology for Directed I/O (VT-d)Yes
Intel 64Yes
Conflict-Free processorNo
Intel® OS GuardYes
Intel Stable Image Platform Program (SIPP)Yes
Intel TSX-NIYes
Intel® Secure KeyYes
Intel® Turbo Boost Technology2.0
Intel Trusted Execution TechnologyYes
Intel® Smart CacheYes
Intel® My WiFi Technology (Intel® MWT)No
Intel® Identity Protection Technology (Intel® IPT)Yes
Intel I/O Acceleration TechnologyYes
Intel® Hyper Threading Technology (Intel® HT Technology)Yes
Intel Flex Memory AccessYes
Intel Fast Memory AccessYes
Intel® Anti-Theft Technology (Intel® AT)Yes
Intel® AES New Instructions (Intel® AES-NI)Yes
Enhanced Intel SpeedStep TechnologyYes
Intel® Virtualization Technology (Intel® VT)VT-d, VT-x
Intel VT-x with Extended Page Tables (EPT)Yes
Intel Enhanced Halt StateYes
Intel Virtualization Technology (VT-x)Yes
Intel Stable Image Platform Program (SIPP) version1.00
Intel Secure Key Technology version1.00
Intel Identity Protection Technology version1.00
Intel TSX-NI version1.00
Intel® vPro™ Platform EligibilityYes
Intel® Turbo Boost Technology 2.0 frequency3.8 GHz
Intel® Transactional Synchronization ExtensionsYes
Packaging data
Package width2.76" (70 mm)
Package depth4.57" (116 mm)
Package height3.98" (101 mm)
Package weight13.2 oz (373 g)
Package typeRetail box
Weight & dimensions
Processor package size37.5 x 37.5 mm
Package width2.76" (70 mm)
Package depth4.57" (116 mm)
Package height3.98" (101 mm)
Package weight13.2 oz (373 g)
Other features
Cache memory8 MB
Intel® Virtualization Technology (Intel® VT)VT-d, VT-x
Maximum internal memory32 GB
Maximum internal memory32768 MB
CPU configuration (max)1

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