Specification:
Processor | |
---|---|
Processor base frequency | 2.26 GHz |
Processor manufacturer | Intel |
Cooler included | Yes |
Processor codename | Clarkdale |
Memory bandwidth supported by processor (max) | 17 GB/s |
Thermal Design Power (TDP) | 30 W |
Processor cache | 4 MB |
Processor ARK ID | 47555 |
Processor model | L3406 |
Processor threads | 4 |
System bus rate | 2.5 GT/s |
Processor operating modes | 64-bit |
Compatible chipsets | Intel® 3400, Intel® 3420, Intel® 3450 |
VID Voltage Range | 0.65 - 1.4 V |
Processor boost frequency | 2.53 GHz |
Stepping | C2 |
CPU multiplier (bus/core ratio) | 17 |
Bus type | DMI |
Component for | Server/workstation |
Processor lithography | 32 nm |
Processor family | Intel® Xeon® |
Processor cores | 2 |
Box | Yes |
Processor socket | LGA 1156 (Socket H) |
Processor code | SLBQQ |
Processor series | Intel Xeon 3400 Series |
Processor cache type | Smart Cache |
Memory | |
Maximum internal memory supported by processor | 16 GB |
Memory types supported by processor | DDR3-SDRAM |
Memory clock speeds supported by processor | 1066 MHz |
Memory bandwidth supported by processor (max) | 17 GB/s |
Supported memory types | DDR3-SDRAM |
Memory channels | Dual-channel |
ECC | Yes |
Graphics | |
On-board graphics card | No |
Power | |
Thermal Design Power (TDP) | 30 W |
VID Voltage Range | 0.65 - 1.4 V |
Technical details | |
Cache memory | 4 MB |
Thermal Monitoring Technologies | No |
Intel® Turbo Boost Technology | 1.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | No |
Idle States | Yes |
Execute Disable Bit | Yes |
Enhanced Intel SpeedStep Technology | Yes |
Intel® Virtualization Technology (Intel® VT) | VT-d, VT-x |
PCI Express slots version | 2.0 |
PCI Express configurations | 1x16, 2x8 |
Number of Processing Die Transistors | 382 M |
Processing Die size | 81 mm² |
Number of Graphics & IMC Die Transistors | 177 M |
Graphics & IMC Die Size | 114 mm² |
Supported instruction sets | SSE4.2 |
Physical Address Extension (PAE) | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Enhanced Halt State | Yes |
Intel Demand Based Switching | Yes |
Graphics & IMC lithography | 45 nm |
Embedded options available | No |
CPU configuration (max) | 1 |
Processor code | SLBQQ |
Product type | Processor |
Processor cache | 4096 KB |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 30 W |
Supported memory types | DDR3-SDRAM |
Status | Discontinued |
Product name | Intel Xeon L3406 (4M Cache, 2.26 GHz) |
Processor series | Intel Xeon 3400 Series |
Processor core voltage | 0.6500-1.400 V |
Physical Address Extension (PAE) | 36 bit |
Market segment | Server |
Launch date | Q1'10 |
Intel Virtualization Technology (VT-x) | Yes |
Processor cache type | Smart Cache |
Bus type units | GT/s |
Bus bandwidth | 2.5 |
Born on date | Q1'10 |
Maximum memory | 16.38 GB |
Processor brand name | Intel Xeon |
Last change | 63903513 |
Product family | Intel Xeon Processor 3000 Sequence |
Bus speed | 2.5 GT/s |
Features | |
Maximum number of PCI Express lanes | 16 |
Thermal Design Power (TDP) | 30 W |
Processor package size | 37.5 x 37.5 mm |
Processor ARK ID | 47555 |
Thermal Monitoring Technologies | No |
Idle States | Yes |
Execute Disable Bit | Yes |
PCI Express slots version | 2.0 |
PCI Express configurations | 1x16, 2x8 |
Number of Processing Die Transistors | 382 M |
Processing Die size | 81 mm² |
Number of Graphics & IMC Die Transistors | 177 M |
Graphics & IMC Die Size | 114 mm² |
Supported instruction sets | SSE4.2 |
Physical Address Extension (PAE) | Yes |
Graphics & IMC lithography | 45 nm |
Embedded options available | No |
CPU configuration (max) | 1 |
Processor code | SLBQQ |
Physical Address Extension (PAE) | 36 bit |
Market segment | Server |
Images Type Map | |
Harmonized System (HS) code | 85423119 |
Export Control Classification Number (ECCN) | 3A991 |
Commodity Classification Automated Tracking System (CCATS) | NA |
PCI Express CEM revision | 2.0 |
Processor special features | |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel® Turbo Boost Technology | 1.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | No |
Enhanced Intel SpeedStep Technology | Yes |
Intel® Virtualization Technology (Intel® VT) | VT-d, VT-x |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Enhanced Halt State | Yes |
Intel Demand Based Switching | Yes |
Intel Virtualization Technology (VT-x) | Yes |
Intel® vPro™ Platform Eligibility | No |
Operational conditions | |
Tcase | 53.9 °C |
Packaging data | |
Package width | 3.19" (81 mm) |
Package depth | 4.49" (114 mm) |
Package height | 4.02" (102 mm) |
Package weight | 13.9 oz (394 g) |
Package type | Retail box |
Weight & dimensions | |
Processor package size | 37.5 x 37.5 mm |
Package width | 3.19" (81 mm) |
Package depth | 4.49" (114 mm) |
Package height | 4.02" (102 mm) |
Package weight | 13.9 oz (394 g) |
Other features | |
Cache memory | 4 MB |
Intel® Virtualization Technology (Intel® VT) | VT-d, VT-x |
Maximum internal memory | 16.38 GB |
Maximum internal memory | 16777 MB |
CPU configuration (max) | 1 |
Processor code | SLBQQ |