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BX80616I3540 - Intel CORE I3-540

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SKU: BX80616I3540
Availability: In Stock
Weight: 1.00 LBS
Shipping: Calculated at Checkout
46C566DB-4644-460E-8DA7-038C0B9646AB E06A9D60-42A9-4459-8131-FA3002495928
Intel Core i3-540. Processor family: Intel® Core™ i3, Processor socket: LGA 1156 (Socket H), Processor lithography: 32 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 16 GB, Memory types supported by processor: DDR3-SDRAM. On-board graphics adapter model: Intel® HD Graphics, On-board graphics adapter base frequency: 733 MHz. Market segment: Desktop, PCI Express configurations: 1x16,2x8, Number of Processing Die Transistors: 382 M. Package width: 3.19" (81 mm), Package depth: 4.49" (114 mm), Package height: 4.02" (102 mm)

 

Specification:

 

Processor
Processor generationIntel® Core™ i3
Processor base frequency3.33 GHz
Processor manufacturerIntel
Cooler includedYes
Processor codenameClarkdale
Memory bandwidth supported by processor (max)21 GB/s
Thermal Design Power (TDP)73 W
Processor cache4 MB
Processor ARK ID50177
Processor modeli3-560
Processor threads4
System bus rate2.5 GT/s
Processor operating modes64-bit
Compatible chipsetsIntel® H55 Express, Intel® H57 Express, Intel® P55 Express, Intel® Q57 Express
VID Voltage Range0.65 - 1.4 V
L3 cache speed3.33 GHz
Bus typeDMI
Component forPC
Processor lithography32 nm
Processor familyIntel® Core™ i3
Processor cores2
BoxYes
Processor socketLGA 1156 (Socket H)
Processor codeSLBY2
Processor seriesIntel Core i3-500 Desktop Series
Processor cache typeSmart Cache
Generation5th Generation
Memory
Maximum internal memory supported by processor16 GB
Memory types supported by processorDDR3-SDRAM
Memory clock speeds supported by processor1066,1333 MHz
Memory bandwidth supported by processor (max)21 GB/s
Supported memory typesDDR3-SDRAM
Memory channelsDual-channel
Graphics
Number of displays supported (on-board graphics)2
On-board graphics card modelIntel® HD Graphics
On-board graphics cardYes
On-board graphics card base frequency733 MHz
Power
Thermal Design Power (TDP)73 W
VID Voltage Range0.65 - 1.4 V
Technical details
Cache memory4 MB
Thermal Monitoring TechnologiesNo
Intel® Turbo Boost TechnologyNo
Intel Trusted Execution TechnologyNo
Intel® Smart CacheYes
Intel® Hyper Threading Technology (Intel® HT Technology)Yes
Intel FDI TechnologyYes
Intel Dual Display Capable TechnologyYes
Intel® Clear Video HD Technology (Intel® CVT HD)Yes
Intel® AES New Instructions (Intel® AES-NI)No
Idle StatesYes
Execute Disable BitYes
Enhanced Intel SpeedStep TechnologyYes
Intel® Virtualization Technology (Intel® VT)VT-x
PCI Express slots version2.0
PCI Express configurations1x16, 2x8
Number of Processing Die Transistors382 M
Processing Die size81 mm²
Number of Graphics & IMC Die Transistors177 M
Graphics & IMC Die Size114 mm²
Supported instruction setsSSE4.2
Physical Address Extension (PAE)Yes
L3 cache speed3.33 GHz
Intel VT-x with Extended Page Tables (EPT)Yes
Intel Enhanced Halt StateYes
Intel Demand Based SwitchingNo
Graphics & IMC lithography45 nm
Embedded options availableNo
CPU configuration (max)1
Processor codeSLBY2
Product typeProcessor
Processor cache4096 KB
Intel 64Yes
Thermal Design Power (TDP)73 W
Supported memory typesDDR3-SDRAM
StatusDiscontinued
Product nameIntel Core i3-560 (4M Cache, 3.33 GHz)
Processor seriesIntel Core i3-500 Desktop Series
Processor core voltage0.6500-1.4000 V
Physical Address Extension (PAE)36 bit
Market segmentDesktop
Launch dateQ3'10
Intel Virtualization Technology (VT-x)Yes
Processor cache typeSmart Cache
Bus type unitsGT/s
Bus bandwidth2.5
Born on dateQ3'10
Maximum memory16.38 GB
Processor brand nameIntel Core i3
Last change63903513
Product familyPrevious Generation Intel Core i3 Processor
Bus speed2.5 GT/s
Features
Maximum number of PCI Express lanes16
Thermal Design Power (TDP)73 W
Processor package size37.5 x 37.5 mm
Processor ARK ID50177
Thermal Monitoring TechnologiesNo
Idle StatesYes
Execute Disable BitYes
PCI Express slots version2.0
PCI Express configurations1x16, 2x8
Number of Processing Die Transistors382 M
Processing Die size81 mm²
Number of Graphics & IMC Die Transistors177 M
Graphics & IMC Die Size114 mm²
Supported instruction setsSSE4.2
Physical Address Extension (PAE)Yes
Graphics & IMC lithography45 nm
Embedded options availableNo
CPU configuration (max)1
Processor codeSLBY2
Physical Address Extension (PAE)36 bit
Market segmentDesktop
Harmonized System (HS) code8542310001
Export Control Classification Number (ECCN)3A991
Commodity Classification Automated Tracking System (CCATS)NA
PCI Express CEM revision2.0
Processor special features
Intel 64Yes
Intel® Turbo Boost TechnologyNo
Intel Trusted Execution TechnologyNo
Intel® Smart CacheYes
Intel® Hyper Threading Technology (Intel® HT Technology)Yes
Intel FDI TechnologyYes
Intel Dual Display Capable TechnologyYes
Intel® Clear Video HD Technology (Intel® CVT HD)Yes
Intel® AES New Instructions (Intel® AES-NI)No
Enhanced Intel SpeedStep TechnologyYes
Intel® Virtualization Technology (Intel® VT)VT-x
Intel VT-x with Extended Page Tables (EPT)Yes
Intel Enhanced Halt StateYes
Intel Demand Based SwitchingNo
Intel Virtualization Technology (VT-x)Yes
Intel® vPro™ Platform EligibilityNo
Operational conditions
Tcase72.6 °C
Packaging data
Package width3.19" (81 mm)
Package depth4.49" (114 mm)
Package height4.02" (102 mm)
Package weight11.9 oz (338 g)
Package typeRetail box
Weight & dimensions
Processor package size37.5 x 37.5 mm
Package width3.19" (81 mm)
Package depth4.49" (114 mm)
Package height4.02" (102 mm)
Package weight11.9 oz (338 g)
Other features
Cache memory4 MB
Intel® Virtualization Technology (Intel® VT)VT-x
Maximum internal memory16.38 GB
Maximum internal memory16777 MB
CPU configuration (max)1
CompatibilityIntel S3420GPLC, S3420GPLX, S3420GPV, S3420GPRX, SR1630GP, SR1630HGP, SR1630GPRX, SR1630HGPRX
Processor codeSLBY2

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