BX80614X5690 - Intel X5690 3.46G 6C 95W PROC KIT

Intel Xeon X5690. Processor family: Intel® Xeon® 5000 Sequence, Processor socket: LGA 1366 (Socket B), Processor lithography: 32 nm. Memory channels: Triple-channel, Maximum internal memory supported by processor: 288 GB, Memory types supported by processor: DDR3-SDRAM. Market segment: Server, Supported instruction sets: SSE4.2, Bandwidth: 26214.4 MB/s. Package width: 1.73" (44 mm), Package depth: 5.51" (140 mm), Package height: 4.61" (117 mm). Processor package size: 42.5mm x 45mm

 

Specification:

 

Processor
Processor base frequency	2.8 GHz
Processor manufacturer	Intel
Memory bandwidth supported by processor (max)	17 GB/s
Thermal Design Power (TDP)	73 W
Processor cache	3 MB
Processor ARK ID	43566
Processor model	G6951
Processor threads	2
System bus rate	2.5 GT/s
Processor operating modes	64-bit
CPU multiplier (bus/core ratio)	21
Processor core voltage (AC)	0.6500 - 1.4000 V
Component for	Notebook
Processor lithography	32 nm
Processor family	Intel® Pentium® Dual-Core
Processor cores	2
Box	Yes
Processor socket	LGA 1156 (Socket H)
Processor code	SLBTF
Processor cache type	L3
Memory
Maximum internal memory supported by processor	16 GB
Memory clock speeds supported by processor	1066 MHz
Memory bandwidth supported by processor (max)	17 GB/s
Memory channels	Dual-channel
Power
Thermal Design Power (TDP)	73 W
Processor core voltage (AC)	0.6500 - 1.4000 V
Technical details
Processor code	SLBTF
Thermal Design Power (TDP)	73 W
Market segment	Desktop
Processor cache type	L3
Features
Thermal Design Power (TDP)	73 W
Processor ARK ID	43566
Processor code	SLBTF
Market segment	Desktop
Operational conditions
Maximum operating temperature	72.6 °C
Packaging data
Package width	3.19" (81 mm)
Package depth	4.49" (114 mm)
Package height	4.02" (102 mm)
Package weight	11.9 oz (338 g)
Weight & dimensions
Package width	3.19" (81 mm)
Package depth	4.49" (114 mm)
Package height	4.02" (102 mm)
Package weight	11.9 oz (338 g)
Other features
Processor code	SLBTF