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BX80605X3450 - Intel INTEL XEON PROCESSOR X3450

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SKU: BX80605X3450
Availability: In Stock
Weight: 1.05 LBS
Shipping: Calculated at Checkout
46C566DB-4644-460E-8DA7-038C0B9646AB E06A9D60-42A9-4459-8131-FA3002495928
Intel Xeon X3450. Processor family: Intel® Xeon® 3000 Sequence, Processor socket: LGA 1156 (Socket H), Processor lithography: 45 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 32 GB, Memory types supported by processor: DDR3-SDRAM. Market segment: Server, PCI Express configurations: 1x16, 2x8, 4x4, Number of Processing Die Transistors: 774 M. Package width: 3.19" (81 mm), Package depth: 4.49" (114 mm), Package height: 4.02" (102 mm). Processor package size: 37.5 x 37.5 mm

 

Specification:

 

Processor
Processor base frequency2.8 GHz
Processor manufacturerIntel
Cooler includedYes
Memory bandwidth supported by processor (max)21 GB/s
Thermal Design Power (TDP)95 W
Processor cache8 MB
Processor ARK ID42931
Processor modelX3460
Processor threads8
System bus rate2.5 GT/s
Processor operating modes64-bit
VID Voltage Range0.65 - 1.4 V
Processor boost frequency3.46 GHz
SteppingB1
L3 cache speed2.8 GHz
CPU multiplier (bus/core ratio)21
Bus typeDMI
Component forServer/workstation
Processor lithography45 nm
Processor familyIntel® Xeon® 3000 Sequence
Processor cores4
BoxYes
Processor socketLGA 1156 (Socket H)
Processor codeSLBJK
Processor seriesIntel Xeon 3400 Series
Processor cache typeSmart Cache
Memory
Maximum internal memory supported by processor32 GB
Memory types supported by processorDDR3-SDRAM
Memory bandwidth supported by processor (max)21 GB/s
Supported memory typesDDR3-SDRAM
Memory channelsDual-channel
ECCYes
Graphics
On-board graphics cardNo
Power
Thermal Design Power (TDP)95 W
VID Voltage Range0.65 - 1.4 V
Technical details
Thermal Monitoring TechnologiesNo
Intel® Turbo Boost Technology1.0
Intel Trusted Execution TechnologyYes
Intel® Hyper Threading Technology (Intel® HT Technology)Yes
Intel® AES New Instructions (Intel® AES-NI)No
Idle StatesYes
Execute Disable BitYes
Enhanced Intel SpeedStep TechnologyYes
PCI Express slots version2.0
PCI Express configurations1x16, 2x8, 4x4
Number of Processing Die Transistors774 M
Processing Die size296 mm²
Supported instruction setsSSE4.2
L3 cache speed2.8 GHz
Intel VT-x with Extended Page Tables (EPT)Yes
Intel Enhanced Halt StateYes
Intel Demand Based SwitchingYes
Embedded options availableNo
CPU configuration (max)1
Processor codeSLBJK
Product typeProcessor
Processor cache8192 KB
Intel Virtualization Technology for Directed I/O (VT-d)Yes
Intel 64Yes
Thermal Design Power (TDP)95 W
Supported memory typesDDR3-SDRAM
StatusDiscontinued
Processor seriesIntel Xeon 3400 Series
Physical Address Extension (PAE)36 bit
Market segmentServer
Launch dateQ3'09
Intel Virtualization Technology (VT-x)Yes
Processor cache typeSmart Cache
Bus type unitsGT/s
Bus bandwidth2.5
Maximum memory32 GB
Processor brand nameIntel Xeon
Last change63903513
Product familyIntel Xeon Processor 3000 Sequence
Bus speed2.5 GT/s
Features
Maximum number of PCI Express lanes16
Thermal Design Power (TDP)95 W
Processor package size37.5 x 37.5 mm
Processor ARK ID42931
Thermal Monitoring TechnologiesNo
Idle StatesYes
Execute Disable BitYes
PCI Express slots version2.0
PCI Express configurations1x16, 2x8, 4x4
Number of Processing Die Transistors774 M
Processing Die size296 mm²
Supported instruction setsSSE4.2
Embedded options availableNo
CPU configuration (max)1
Processor codeSLBJK
Physical Address Extension (PAE)36 bit
Market segmentServer
Images Type Map
Harmonized System (HS) code8542310001
Export Control Classification Number (ECCN)3A991
Commodity Classification Automated Tracking System (CCATS)NA
PCI Express CEM revision2.0
Processor special features
Intel Virtualization Technology for Directed I/O (VT-d)Yes
Intel 64Yes
Conflict-Free processorNo
Intel® Turbo Boost Technology1.0
Intel Trusted Execution TechnologyYes
Intel® Hyper Threading Technology (Intel® HT Technology)Yes
Intel® AES New Instructions (Intel® AES-NI)No
Enhanced Intel SpeedStep TechnologyYes
Intel VT-x with Extended Page Tables (EPT)Yes
Intel Enhanced Halt StateYes
Intel Demand Based SwitchingYes
Intel Virtualization Technology (VT-x)Yes
Intel® vPro™ Platform EligibilityNo
Operational conditions
Tcase72.7 °C
Packaging data
Package width3.19" (81 mm)
Package depth4.49" (114 mm)
Package height4.02" (102 mm)
Package weight13.9 oz (394 g)
Package typeRetail box
Weight & dimensions
Processor package size37.5 x 37.5 mm
Package width3.19" (81 mm)
Package depth4.49" (114 mm)
Package height4.02" (102 mm)
Package weight13.9 oz (394 g)
Other features
Maximum internal memory32 GB
Maximum internal memory32768 MB
CPU configuration (max)1
Processor codeSLBJK

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