BX80605I7870 - Intel CORE I7-870 2.93 GHZ

Intel Core i7-870. Processor family: Intel® Core™ i7, Processor socket: LGA 1156 (Socket H), Processor lithography: 45 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 16 GB, Memory types supported by processor: DDR3-SDRAM. Market segment: Desktop, PCI Express configurations: 1x16, 2x8, Number of Processing Die Transistors: 774 M. Package width: 3.19" (81 mm), Package depth: 4.49" (114 mm), Package height: 4.02" (102 mm). Processor package size: 37.5 x 37.5 mm

 

Specification:

 

Processor
Processor base frequency	2.4 GHz
Processor manufacturer	Intel
Cooler included	Yes
Memory bandwidth supported by processor (max)	21 GB/s
Thermal Design Power (TDP)	95 W
Processor cache	8 MB
Processor ARK ID	42927
Processor model	X3430
Processor threads	4
System bus rate	2.5 GT/s
Processor operating modes	64-bit
VID Voltage Range	0.65 - 1.4 V
Processor boost frequency	2.8 GHz
Stepping	B1
L3 cache speed	2.4 GHz
CPU multiplier (bus/core ratio)	18
Bus type	DMI
Component for	Server/workstation
Processor lithography	45 nm
Processor family	Intel® Xeon® 3000 Sequence
Processor cores	4
Box	Yes
Processor socket	LGA 1156 (Socket H)
Processor code	SLBLJ
Processor series	Intel Xeon 3400 Series
Processor cache type	Smart Cache
Memory
Maximum internal memory supported by processor	32 GB
Memory types supported by processor	DDR3-SDRAM
Memory bandwidth supported by processor (max)	21 GB/s
Supported memory types	DDR3-SDRAM
Memory channels	Dual-channel
ECC	Yes
Graphics
On-board graphics card	No
Power
Thermal Design Power (TDP)	95 W
VID Voltage Range	0.65 - 1.4 V
Technical details
Thermal Monitoring Technologies	No
Intel® Turbo Boost Technology	1.0
Intel Trusted Execution Technology	Yes
Intel® Hyper Threading Technology (Intel® HT Technology)	No
Intel® AES New Instructions (Intel® AES-NI)	No
Idle States	Yes
Execute Disable Bit	Yes
Enhanced Intel SpeedStep Technology	Yes
PCI Express slots version	2.0
PCI Express configurations	1x16, 2x8, 4x4
Number of Processing Die Transistors	774 M
Processing Die size	296 mm²
Supported instruction sets	SSE4.2
L3 cache speed	2.4 GHz
Intel VT-x with Extended Page Tables (EPT)	Yes
Intel Enhanced Halt State	Yes
Intel Demand Based Switching	Yes
Embedded options available	Yes
CPU configuration (max)	1
Processor code	SLBLJ
Product type	Processor
Processor cache	8192 KB
Intel Virtualization Technology for Directed I/O (VT-d)	Yes
Intel 64	Yes
Thermal Design Power (TDP)	95 W
Supported memory types	DDR3-SDRAM
Status	Discontinued
Processor series	Intel Xeon 3400 Series
Physical Address Extension (PAE)	36 bit
Market segment	Server
Launch date	Q3'09
Intel Virtualization Technology (VT-x)	Yes
Processor cache type	Smart Cache
Bus type units	GT/s
Bus bandwidth	2.5
Maximum memory	32 GB
Processor brand name	Intel Xeon
Last change	63903513
Product family	Intel Xeon Processor 3000 Sequence
Bus speed	2.5 GT/s
Features
Maximum number of PCI Express lanes	16
Thermal Design Power (TDP)	95 W
Processor package size	37.5 x 37.5 mm
Processor ARK ID	42927
Thermal Monitoring Technologies	No
Idle States	Yes
Execute Disable Bit	Yes
PCI Express slots version	2.0
PCI Express configurations	1x16, 2x8, 4x4
Number of Processing Die Transistors	774 M
Processing Die size	296 mm²
Supported instruction sets	SSE4.2
Embedded options available	Yes
CPU configuration (max)	1
Processor code	SLBLJ
Physical Address Extension (PAE)	36 bit
Market segment	Server
Images Type Map
Harmonized System (HS) code	8542310001
Export Control Classification Number (ECCN)	3A991
Commodity Classification Automated Tracking System (CCATS)	NA
PCI Express CEM revision	2.0
Processor special features
Intel Virtualization Technology for Directed I/O (VT-d)	Yes
Intel 64	Yes
Conflict-Free processor	No
Intel® Turbo Boost Technology	1.0
Intel Trusted Execution Technology	Yes
Intel® Hyper Threading Technology (Intel® HT Technology)	No
Intel® AES New Instructions (Intel® AES-NI)	No
Enhanced Intel SpeedStep Technology	Yes
Intel VT-x with Extended Page Tables (EPT)	Yes
Intel Enhanced Halt State	Yes
Intel Demand Based Switching	Yes
Intel Virtualization Technology (VT-x)	Yes
Intel® vPro™ Platform Eligibility	No
Operational conditions
Tcase	72.7 °C
Packaging data
Package width	3.19" (81 mm)
Package depth	4.49" (114 mm)
Package height	4.02" (102 mm)
Package weight	13.9 oz (394 g)
Package type	Retail box
Weight & dimensions
Processor package size	37.5 x 37.5 mm
Package width	3.19" (81 mm)
Package depth	4.49" (114 mm)
Package height	4.02" (102 mm)
Package weight	13.9 oz (394 g)
Other features
Maximum internal memory	32 GB
Maximum internal memory	32768 MB
CPU configuration (max)	1
Processor code	SLBLJ