Specification:
Processor | |
---|---|
Processor base frequency | 2.66 GHz |
Processor manufacturer | Intel |
Cooler included | Yes |
Thermal Design Power (TDP) | 130 W |
Processor cache | 16 MB |
Processor ARK ID | 36947 |
Processor model | X7460 |
Processor threads | 6 |
Processor operating modes | 64-bit |
VID Voltage Range | 0.9 - 1.45 V |
Stepping | A1 |
L2 cache speed | 2.66 GHz |
FSB Parity | Yes |
CPU multiplier (bus/core ratio) | 10 |
Bus type | FSB |
Component for | Server/workstation |
Processor lithography | 45 nm |
Processor family | Intel® Xeon® 7000 Sequence |
Processor front side bus | 1066 MHz |
Processor cores | 6 |
Box | Yes |
Processor socket | Socket 604 (mPGA604) |
Processor code | SLG9P |
Processor series | Intel Xeon 7400 Series |
Processor cache type | L2 |
Power | |
Thermal Design Power (TDP) | 130 W |
VID Voltage Range | 0.9 - 1.45 V |
Technical details | |
Intel® Turbo Boost Technology | No |
Intel Trusted Execution Technology | No |
Intel® Hyper Threading Technology (Intel® HT Technology) | No |
Idle States | No |
Execute Disable Bit | Yes |
Enhanced Intel SpeedStep Technology | Yes |
Number of Processing Die Transistors | 1900 M |
Processing Die size | 503 mm² |
L2 cache speed | 2.66 GHz |
Intel Enhanced Halt State | No |
Intel Demand Based Switching | Yes |
Embedded options available | No |
Processor code | SLG9P |
Product type | Processor |
Processor cache | 16384 KB |
Intel 64 | Yes |
Thermal Design Power (TDP) | 130 W |
Status | Discontinued |
Processor series | Intel Xeon 7400 Series |
Market segment | Server |
Launch date | Q3'08 |
Intel Virtualization Technology (VT-x) | Yes |
Processor cache type | L2 |
Bus type units | MHz |
Bus bandwidth | 1066 |
Processor brand name | Intel Xeon |
Last change | 63903513 |
Product family | Intel Xeon Processor 7000 Sequence |
Bus speed | 1066 MHz |
Features | |
Thermal Design Power (TDP) | 130 W |
Processor package size | 53.3mm x 53.3mm |
Processor ARK ID | 36947 |
Idle States | No |
Execute Disable Bit | Yes |
Number of Processing Die Transistors | 1900 M |
Processing Die size | 503 mm² |
Embedded options available | No |
Processor code | SLG9P |
Market segment | Server |
Images Type Map | |
Harmonized System (HS) code | 8542310001 |
Export Control Classification Number (ECCN) | 3A991.A.1 |
Commodity Classification Automated Tracking System (CCATS) | NA |
Processor special features | |
Intel 64 | Yes |
Conflict-Free processor | No |
Intel® Turbo Boost Technology | No |
Intel Trusted Execution Technology | No |
Intel® Hyper Threading Technology (Intel® HT Technology) | No |
Enhanced Intel SpeedStep Technology | Yes |
Intel Enhanced Halt State | No |
Intel Demand Based Switching | Yes |
Intel Virtualization Technology (VT-x) | Yes |
Operational conditions | |
Tcase | 64 °C |
Maximum operating temperature | 64 °C |
Packaging data | |
Package width | 1.73" (44 mm) |
Package depth | 5.51" (140 mm) |
Package height | 4.61" (117 mm) |
Package weight | 4.23 oz (120 g) |
Package type | Retail box |
Weight & dimensions | |
Processor package size | 53.3mm x 53.3mm |
Package width | 1.73" (44 mm) |
Package depth | 5.51" (140 mm) |
Package height | 4.61" (117 mm) |
Package weight | 4.23 oz (120 g) |
Other features | |
Processor code | SLG9P |