BX805565130A - Intel XEON 5130

Intel Xeon 5130. Processor family: Intel® Xeon®, Processor socket: LGA 771 (Socket J), Processor lithography: 65 nm. Market segment: Server, Number of Processing Die Transistors: 291 M, Processing Die size: 143 mm². Processor package size: 37.5 x 37.5 mm

 

Specification:

 

Processor
Processor base frequency	2.33 GHz
Processor manufacturer	Intel
Cooler included	Yes
Processor codename	Woodcrest
Thermal Design Power (TDP)	65 W
Processor cache	4 MB
Processor ARK ID	27217
Processor model	5140
Processor threads	2
Processor operating modes	64-bit
VID Voltage Range	0.85 - 1.5 V
FSB Parity	Yes
CPU multiplier (bus/core ratio)	7
Bus type	FSB
Processor lithography	65 nm
Processor family	Intel® Xeon® 5000 Sequence
Processor front side bus	1333 MHz
Processor cores	2
Box	Yes
Processor socket	LGA 771 (Socket J)
Processor series	Intel Xeon 5100 Series
Processor cache type	L2
Power
Thermal Design Power (TDP)	65 W
VID Voltage Range	0.85 - 1.5 V
Technical details
Cache memory	4 MB
Thermal Monitoring Technologies	Yes
Intel® Turbo Boost Technology	No
Intel Trusted Execution Technology	No
Intel® Hyper Threading Technology (Intel® HT Technology)	No
Idle States	Yes
Execute Disable Bit	Yes
Enhanced Intel SpeedStep Technology	Yes
Number of Processing Die Transistors	291 M
Processing Die size	143 mm²
Number of Graphics & IMC Die Transistors	291 M
Intel VT-x with Extended Page Tables (EPT)	No
Intel Enhanced Halt State	Yes
Intel Demand Based Switching	No
Embedded options available	Yes
Product type	Processor
Processor cache	4096 KB
Intel 64	Yes
Thermal Design Power (TDP)	65 W
Status	Discontinued
Product name	Intel Xeon 5140 (4M Cache, 2.33 GHz, 1333 MHz FSB)
Processor series	Intel Xeon 5100 Series
Processor core voltage	B2=1.0-1.5, G0=.85-1.5
Market segment	Server
Launch date	Q2'06
Intel Virtualization Technology (VT-x)	Yes
Processor cache type	L2
Bus type units	MHz
Bus bandwidth	1333
Born on date	Q2'06
Processor brand name	Intel Xeon
Last change	63903513
Product family	Intel Xeon Processor 5000 Sequence
Bus speed	1333 MHz
Features
Thermal Design Power (TDP)	65 W
Processor package size	37.5 x 37.5 mm
Processor ARK ID	27217
Thermal Monitoring Technologies	Yes
Idle States	Yes
Execute Disable Bit	Yes
Number of Processing Die Transistors	291 M
Processing Die size	143 mm²
Number of Graphics & IMC Die Transistors	291 M
Embedded options available	Yes
Market segment	Server
Images Type Map
Harmonized System (HS) code	8542310001
Export Control Classification Number (ECCN)	3A991.A.1
Commodity Classification Automated Tracking System (CCATS)	NA
Processor special features
Intel 64	Yes
Conflict-Free processor	No
Intel® Turbo Boost Technology	No
Intel Trusted Execution Technology	No
Intel® Hyper Threading Technology (Intel® HT Technology)	No
Enhanced Intel SpeedStep Technology	Yes
Intel VT-x with Extended Page Tables (EPT)	No
Intel Enhanced Halt State	Yes
Intel Demand Based Switching	No
Intel Virtualization Technology (VT-x)	Yes
Operational conditions
Tcase	65 °C
Maximum operating temperature	65 °C
Packaging data
Package type	Retail box
Weight & dimensions
Processor package size	37.5 x 37.5 mm
Other features
Cache memory	4 MB