BX805565110A - Intel INTEL XEON PROCESSOR 5110

Intel Xeon 5110. Processor family: Intel® Xeon® 5000 Sequence, Processor socket: LGA 771 (Socket J), Processor lithography: 65 nm. Number of Processing Die Transistors: 291 M, Processing Die size: 143 mm², Number of Graphics & IMC Die Transistors: 291 M. Package type: Retail box. Processor package size: 37.5 x 37.5 mm. Cache memory: 4 MB

 

Specification:

 

Processor
Processor base frequency	1.6 GHz
Processor manufacturer	Intel
Cooler included	Yes
Thermal Design Power (TDP)	65 W
Processor cache	4 MB
Processor ARK ID	27214
Processor model	5110
Processor threads	2
Processor operating modes	64-bit
VID Voltage Range	0.85 - 1.5 V
FSB Parity	Yes
CPU multiplier (bus/core ratio)	6
Bus type	FSB
Component for	Server/workstation
Processor lithography	65 nm
Processor family	Intel® Xeon® 5000 Sequence
Processor front side bus	1066 MHz
Processor cores	2
Box	Yes
Processor socket	LGA 771 (Socket J)
Processor series	Intel Xeon 5100 Series
Processor cache type	L2
Power
Thermal Design Power (TDP)	65 W
VID Voltage Range	0.85 - 1.5 V
Technical details
Thermal Monitoring Technologies	Yes
Intel® Turbo Boost Technology	No
Intel Trusted Execution Technology	No
Intel® Hyper Threading Technology (Intel® HT Technology)	No
Idle States	Yes
Execute Disable Bit	Yes
Enhanced Intel SpeedStep Technology	Yes
Number of Processing Die Transistors	291 M
Processing Die size	143 mm²
Intel VT-x with Extended Page Tables (EPT)	No
Intel Enhanced Halt State	Yes
Intel Demand Based Switching	No
Embedded options available	No
Product type	Processor
Processor cache	4096 KB
Intel 64	Yes
Thermal Design Power (TDP)	65 W
Status	Discontinued
Processor series	Intel Xeon 5100 Series
Market segment	Server
Intel Virtualization Technology (VT-x)	Yes
Processor cache type	L2
Bus type units	MHz
Bus bandwidth	1066
Processor brand name	Intel Xeon
Last change	63903513
Product family	Intel Xeon Processor 5000 Sequence
Bus speed	1066 MHz
Features
Thermal Design Power (TDP)	65 W
Processor package size	37.5 x 37.5 mm
Processor ARK ID	27214
Thermal Monitoring Technologies	Yes
Idle States	Yes
Execute Disable Bit	Yes
Number of Processing Die Transistors	291 M
Processing Die size	143 mm²
Embedded options available	No
Market segment	Server
Images Type Map
Harmonized System (HS) code	8542310001
Export Control Classification Number (ECCN)	3A991.A.1
Commodity Classification Automated Tracking System (CCATS)	NA
Processor special features
Intel 64	Yes
Conflict-Free processor	No
Intel® Turbo Boost Technology	No
Intel Trusted Execution Technology	No
Intel® Hyper Threading Technology (Intel® HT Technology)	No
Enhanced Intel SpeedStep Technology	Yes
Intel VT-x with Extended Page Tables (EPT)	No
Intel Enhanced Halt State	Yes
Intel Demand Based Switching	No
Intel Virtualization Technology (VT-x)	Yes
Operational conditions
Tcase	65 °C
Packaging data
Package width	6.18" (157 mm)
Package depth	15.2" (387 mm)
Package height	6.81" (173 mm)
Package type	Retail box
Weight & dimensions
Processor package size	37.5 x 37.5 mm
Package width	6.18" (157 mm)
Package depth	15.2" (387 mm)
Package height	6.81" (173 mm)