Processor | |
---|---|
Processor generation | 1st Generation Intel® Xeon® Scalable |
Processor base frequency | 1.7 GHz |
Processor codename | Skylake |
Thermal Design Power (TDP) | 85 W |
Processor cache | 11 MB |
Processor model | 3106 |
Processor threads | 8 |
Processor operating modes | 64-bit |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel Xeon Bronze |
Processor cores | 8 |
Processor socket | LGA 3647 (Socket P) |
Processor cache type | L3 |
Memory | |
Maximum internal memory supported by processor | 768 GB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2133 MHz |
Memory channels | Hexa-channel |
ECC | Yes |
Graphics | |
On-board graphics card | No |
Power | |
Thermal Design Power (TDP) | 85 W |
Technical details | |
Intel TSX-NI | Yes |
Intel® Turbo Boost Technology | No |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | No |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
PCI Express slots version | 3.0 |
Scalability | 2S |
Embedded options available | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 85 W |
Market segment | Server |
Intel Virtualization Technology (VT-x) | Yes |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 85 W |
Processor package size | 76 x 56.5 mm |
PCI Express slots version | 3.0 |
Scalability | 2S |
Embedded options available | Yes |
Market segment | Server |
Processor special features | |
Intel 64 | Yes |
Conflict-Free processor | Yes |
Intel Turbo Boost Max Technology 3.0 | No |
Intel® Speed Shift Technology | Yes |
Intel® Optane™ Memory Ready | No |
Intel TSX-NI | Yes |
Intel® Turbo Boost Technology | No |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | No |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
Intel® vPro™ Platform Eligibility | Yes |
Operational conditions | |
Tcase | 77 °C |
Weight & dimensions | |
Processor package size | 76 x 56.5 mm |
Other features | |
Compatibility | Lenovo ThinkSystem SR650 |
Specification:
Processor | |
---|---|
Processor generation | 1st Generation Intel® Xeon® Scalable |
Processor base frequency | 1.8 GHz |
Processor codename | Skylake |
Thermal Design Power (TDP) | 85 W |
Processor cache | 11 MB |
Processor model | 4108 |
Processor threads | 16 |
System bus rate | 9.6 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 3 GHz |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel Xeon Silver |
Processor cores | 8 |
Processor socket | LGA 3647 (Socket P) |
Processor cache type | L3 |
Memory | |
Maximum internal memory supported by processor | 768 GB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2400 MHz |
Memory channels | Hexa-channel |
ECC | Yes |
Graphics | |
On-board graphics card | No |
Power | |
Thermal Design Power (TDP) | 85 W |
Technical details | |
Intel TSX-NI | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | AVX, AVX 2.0, AVX-512, SSE4.2 |
Embedded options available | No |
Intel 64 | Yes |
Thermal Design Power (TDP) | 85 W |
Market segment | Server |
Intel Virtualization Technology (VT-x) | Yes |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 85 W |
Processor package size | 76 x 56.5 mm |
PCI Express slots version | 3.0 |
Supported instruction sets | AVX, AVX 2.0, AVX-512, SSE4.2 |
Embedded options available | No |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Processor special features | |
Intel 64 | Yes |
Conflict-Free processor | Yes |
Intel® Speed Shift Technology | Yes |
Intel® Optane™ Memory Ready | No |
Intel TSX-NI | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
Intel® vPro™ Platform Eligibility | Yes |
Operational conditions | |
Tcase | 77 °C |
Weight & dimensions | |
Processor package size | 76 x 56.5 mm |