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7XG7A05526 - Lenovo THINKSYSTEM SR630 INTEL XEON BRONZE 3106 8C 85W 1.7GHZ PROCESSOR OPTION KIT

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SKU: 7XG7A05526
Availability: In Stock
Weight: 2.15 LBS
Shipping: Calculated at Checkout
46C566DB-4644-460E-8DA7-038C0B9646AB E06A9D60-42A9-4459-8131-FA3002495928
Processor
Processor generation1st Generation Intel® Xeon® Scalable
Processor base frequency1.7 GHz
Processor codenameSkylake
Thermal Design Power (TDP)85 W
Processor cache11 MB
Processor model3106
Processor threads8
Processor operating modes64-bit
Component forServer/workstation
Processor lithography14 nm
Processor familyIntel Xeon Bronze
Processor cores8
Processor socketLGA 3647 (Socket P)
Processor cache typeL3
Memory
Maximum internal memory supported by processor768 GB
Memory types supported by processorDDR4-SDRAM
Memory clock speeds supported by processor2133 MHz
Memory channelsHexa-channel
ECCYes
Graphics
On-board graphics cardNo
Power
Thermal Design Power (TDP)85 W
Technical details
Intel TSX-NIYes
Intel® Turbo Boost TechnologyNo
Intel Trusted Execution TechnologyYes
Intel® Hyper Threading Technology (Intel® HT Technology)No
Intel® AES New Instructions (Intel® AES-NI)Yes
PCI Express slots version3.0
Scalability2S
Embedded options availableYes
Intel 64Yes
Thermal Design Power (TDP)85 W
Market segmentServer
Intel Virtualization Technology (VT-x)Yes
Processor cache typeL3
Features
Maximum number of PCI Express lanes48
Thermal Design Power (TDP)85 W
Processor package size76 x 56.5 mm
PCI Express slots version3.0
Scalability2S
Embedded options availableYes
Market segmentServer
Processor special features
Intel 64Yes
Conflict-Free processorYes
Intel Turbo Boost Max Technology 3.0No
Intel® Speed Shift TechnologyYes
Intel® Optane™ Memory ReadyNo
Intel TSX-NIYes
Intel® Turbo Boost TechnologyNo
Intel Trusted Execution TechnologyYes
Intel® Hyper Threading Technology (Intel® HT Technology)No
Intel® AES New Instructions (Intel® AES-NI)Yes
Intel Virtualization Technology (VT-x)Yes
Intel® vPro™ Platform EligibilityYes
Operational conditions
Tcase77 °C
Weight & dimensions
Processor package size76 x 56.5 mm
Other features
CompatibilityLenovo ThinkSystem SR630

 

Specification:

 

Processor
Processor generation1st Generation Intel® Xeon® Scalable
Processor base frequency1.8 GHz
Processor manufacturerIntel
Processor codenameSkylake
Thermal Design Power (TDP)85 W
Processor cache11 MB
Processor ARK ID123544
Processor model4108
Processor threads16
System bus rate9.6 GT/s
Processor operating modes64-bit
Processor boost frequency3 GHz
Component forServer/workstation
Processor lithography14 nm
Processor familyIntel Xeon Silver
Processor cores8
Processor socketLGA 3647 (Socket P)
Processor cache typeL3
Memory
Maximum internal memory supported by processor768 GB
Memory types supported by processorDDR4-SDRAM
Memory clock speeds supported by processor2400 MHz
Memory channelsHexa-channel
ECCYes
Graphics
On-board graphics cardNo
Power
Thermal Design Power (TDP)85 W
Technical details
Intel TSX-NIYes
Intel® Turbo Boost Technology2.0
Intel Trusted Execution TechnologyYes
Intel® Hyper Threading Technology (Intel® HT Technology)Yes
Intel® AES New Instructions (Intel® AES-NI)Yes
PCI Express slots version3.0
Supported instruction setsAVX, AVX 2.0, AVX-512, SSE4.2
Embedded options availableNo
Intel 64Yes
Thermal Design Power (TDP)85 W
Market segmentServer
Intel Virtualization Technology (VT-x)Yes
Processor cache typeL3
Features
Maximum number of PCI Express lanes48
Thermal Design Power (TDP)85 W
Processor package size76 x 56.5 mm
Processor ARK ID123544
PCI Express slots version3.0
Supported instruction setsAVX, AVX 2.0, AVX-512, SSE4.2
Embedded options availableNo
Market segmentServer
Harmonized System (HS) code85423119
Processor special features
Intel 64Yes
Conflict-Free processorYes
Intel® Speed Shift TechnologyYes
Intel® Optane™ Memory ReadyNo
Intel TSX-NIYes
Intel® Turbo Boost Technology2.0
Intel Trusted Execution TechnologyYes
Intel® Hyper Threading Technology (Intel® HT Technology)Yes
Intel® AES New Instructions (Intel® AES-NI)Yes
Intel Virtualization Technology (VT-x)Yes
Intel® vPro™ Platform EligibilityYes
Operational conditions
Tcase77 °C
Weight & dimensions
Processor package size76 x 56.5 mm

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