7XG7A04966 - Lenovo SR850 XEON 6142M 16C/150W/2.6GHZ
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Lenovo
7XG7A04966 - Lenovo SR850 XEON 6142M 16C/150W/2.6GHZ
$17,024.02
$9,457.79
(You save
$7,566.23
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SKU:
7XG7A04966
Availability:
In Stock
Weight:
2.00 LBS
Shipping:
Calculated at Checkout
With two processors installed, the two processors are connected together using one UPI link. With four processors installed, the processors are connected together using a ring topology, using two UPI links, one to each adjacent processor in the ring. Processors with the T suffix have more robust thermal characteristics (higher T-case). Processors with the M suffix support support greater than 768 GB per processor.
Specification:
| Processor | |
|---|---|
| Processor base frequency | 2.3 GHz |
| Cooler included | Yes |
| Processor codename | Skylake |
| Thermal Design Power (TDP) | 140 W |
| Processor cache | 24.75 MB |
| Processor model | 6140M |
| Processor threads | 36 |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.7 GHz |
| Stepping | H0 |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel® Xeon® Gold |
| Processor cores | 18 |
| Processor socket | LGA 3647 (Socket P) |
| Processor cache type | L3 |
| Memory | |
| Maximum internal memory supported by processor | 1500 GB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2666 MHz |
| Memory channels | Hexa-channel |
| ECC | Yes |
| Graphics | |
| On-board graphics card | No |
| Power | |
| Thermal Design Power (TDP) | 140 W |
| Technical details | |
| Intel TSX-NI | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| PCI Express slots version | 3.0 |
| Scalability | S4S |
| Embedded options available | No |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 140 W |
| Market segment | Server |
| Intel Virtualization Technology (VT-x) | Yes |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 140 W |
| PCI Express slots version | 3.0 |
| Scalability | S4S |
| Embedded options available | No |
| Market segment | Server |
| Processor special features | |
| Intel 64 | Yes |
| Conflict-Free processor | Yes |
| Intel Turbo Boost Max Technology 3.0 | No |
| Intel® Speed Shift Technology | Yes |
| Intel® Optane™ Memory Ready | No |
| Intel TSX-NI | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| Intel® vPro™ Platform Eligibility | Yes |
| Operational conditions | |
| Tcase | 91 °C |
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