7XG7A03947 - Lenovo SR850 XEON 6132 14C/140W/2.6GHZ

With two processors installed, the two processors are connected together using one UPI link. With four processors installed, the processors are connected together using a ring topology, using two UPI links, one to each adjacent processor in the ring. Processors with the T suffix have more robust thermal characteristics (higher T-case). Processors with the M suffix support support greater than 768 GB per processor.

 

Specification:

 

Processor
Processor generation	1st Generation Intel® Xeon® Scalable
Processor base frequency	3.2 GHz
Processor codename	Skylake
Thermal Design Power (TDP)	150 W
Processor cache	24.75 MB
Processor model	6136
Processor threads	24
Processor operating modes	64-bit
Processor boost frequency	3.7 GHz
Component for	Server/workstation
Processor lithography	14 nm
Processor family	Intel® Xeon®
Processor cores	12
Processor socket	LGA 3647 (Socket P)
Processor cache type	L3
Memory
Maximum internal memory supported by processor	768 GB
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	2666 MHz
Memory channels	Hexa-channel
ECC	Yes
Graphics
On-board graphics card	No
Power
Thermal Design Power (TDP)	150 W
Technical details
Intel TSX-NI	Yes
Intel® Turbo Boost Technology	2.0
Intel Trusted Execution Technology	Yes
Intel® Hyper Threading Technology (Intel® HT Technology)	Yes
Intel® AES New Instructions (Intel® AES-NI)	Yes
PCI Express slots version	3.0
Scalability	S4S
Embedded options available	No
Intel 64	Yes
Thermal Design Power (TDP)	150 W
Market segment	Server
Intel Virtualization Technology (VT-x)	Yes
Processor cache type	L3
Features
Maximum number of PCI Express lanes	48
Thermal Design Power (TDP)	150 W
Processor package size	76 x 56.5 mm
PCI Express slots version	3.0
Scalability	S4S
Embedded options available	No
Market segment	Server
Processor special features
Intel 64	Yes
Conflict-Free processor	Yes
Intel Turbo Boost Max Technology 3.0	No
Intel® Speed Shift Technology	Yes
Intel® Optane™ Memory Ready	No
Intel TSX-NI	Yes
Intel® Turbo Boost Technology	2.0
Intel Trusted Execution Technology	Yes
Intel® Hyper Threading Technology (Intel® HT Technology)	Yes
Intel® AES New Instructions (Intel® AES-NI)	Yes
Intel Virtualization Technology (VT-x)	Yes
Intel® vPro™ Platform Eligibility	Yes
Operational conditions
Tcase	85 °C
Weight & dimensions
Processor package size	76 x 56.5 mm
Other features
Compatibility	Lenovo ThinkSystem SR850