In addition, TruDDR4 Memory DIMMs have a unique signature programmed into them so your system can verify that TruDDR4 Memory is installed in your system. Since the memory will be authenticated, memory stretch goals are enabled only when TruDDR4 Memory DIMMs are detected. Together with lower power consumption, these new DIMMs can provide the lowest TCO for data centers.
3DS RDIMMs
To meet the ever increasing demand for higher density server memory modules, Lenovo offers 3DS (3 Dimensional Stacked) DDR4 RDIMMs which apply TSV (Through Silicon Via) technology from our partnership with a leading Tier 1 DRAM supplier. The new TSV 3DS stack technology enables higher density DRAM stack packages with higher operational frequency and reduced power consumption. The RDIMM configuration along with 3DS TSV DRAM packages exhibits performance benefits and lower power consumption over alternative high density solutions to ultimately provide the lowest TCO for data centers.