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4XG7A63477 - Lenovo SR650 V2 GOLD 5315Y 8C 140W 3.2GHZ

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SKU: 4XG7A63477
Availability: In Stock
Weight: 10.00 LBS
Shipping: Calculated at Checkout
46C566DB-4644-460E-8DA7-038C0B9646AB E06A9D60-42A9-4459-8131-FA3002495928
Processor
Processor generation3rd Generation Intel® Xeon® Scalable
Processor base frequency3.2 GHz
Processor manufacturerIntel
Processor codenameIce Lake
Thermal Design Power (TDP)140 W
Processor cache12 MB
Processor model5315Y
Processor threads16
System bus rate11.2 GT/s
Processor operating modes64-bit
Processor boost frequency3.6 GHz
Component forServer/workstation
Processor lithography10 nm
Processor familyIntel® Xeon® Gold
Processor cores8
Processor socketFCLGA4189
Processor seriesIntel Xeon Gold 5000 Series
Memory
Memory types supported by processorDDR4-SDRAM
Supported memory typesDDR4-SDRAM
Memory channelsOcta-channel
ECCYes
Graphics
Discrete graphics cardNo
On-board graphics card modelNot available
On-board graphics cardNo
Discrete graphics card modelNot available
Power
Thermal Design Power (TDP)140 W
Technical details
Intel® Turbo Boost Technology2.0
Intel Trusted Execution TechnologyYes
Intel® Hyper Threading Technology (Intel® HT Technology)Yes
Intel® AES New Instructions (Intel® AES-NI)Yes
Execute Disable BitYes
PCI Express slots version4.0
Supported instruction setsSSE4.2, AVX, AVX 2.0, AVX-512
Scalability2S
Intel VT-x with Extended Page Tables (EPT)Yes
Embedded options availableYes
Intel Virtualization Technology for Directed I/O (VT-d)Yes
Intel 64Yes
Thermal Design Power (TDP)140 W
Supported memory typesDDR4-SDRAM
StatusLaunched
Processor seriesIntel Xeon Gold 5000 Series
Market segmentServer
Launch dateQ2'21
Intel Virtualization Technology (VT-x)Yes
Number of UPI links3
Memory speed (max)2933 MHz
AVX-512 Fused Multiply-Add (FMA) units2
Target marketCloud Computing
Features
Maximum number of PCI Express lanes64
Thermal Design Power (TDP)140 W
Processor package size77.5 x 56.5 mm
Execute Disable BitYes
PCI Express slots version4.0
Supported instruction setsSSE4.2, AVX, AVX 2.0, AVX-512
Scalability2S
Embedded options availableYes
Market segmentServer
Harmonized System (HS) code85423119
Export Control Classification Number (ECCN)5A992CN3
Commodity Classification Automated Tracking System (CCATS)G178966
Processor special features
Intel Software Guard Extensions (Intel SGX)Yes
Intel Virtualization Technology for Directed I/O (VT-d)Yes
Intel 64Yes
Intel® Speed Shift TechnologyYes
Intel® Turbo Boost Technology2.0
Intel Trusted Execution TechnologyYes
Intel® Hyper Threading Technology (Intel® HT Technology)Yes
Intel® AES New Instructions (Intel® AES-NI)Yes
Intel VT-x with Extended Page Tables (EPT)Yes
Intel Virtualization Technology (VT-x)Yes
AVX-512 Fused Multiply-Add (FMA) units2
Intel® Volume Management Device (VMD)Yes
Intel® Speed Select technology - Performance Profile (Intel® SST-PP)Yes
Intel® Optane™ DC Persistent Memory SupportedYes
Intel® Deep Learning Boost (Intel® DL Boost)Yes
Mode-based Execute Control (MBE)Yes
Intel® Run Sure TechnologyYes
Intel® Resource Director Technology (Intel® RDT)Yes
Intel® Transactional Synchronization ExtensionsYes
Intel® Total Memory EncryptionYes
Maximum Enclave Size Support for Intel® SGX64 GB
Intel® Platform Firmware Resilience SupportYes
Intel® Crypto AccelerationYes
Operational conditions
Tcase81 °C
Weight & dimensions
Processor package size77.5 x 56.5 mm
Other features
Maximum internal memory6000 GB

 

Specification:

 

Processor
Processor base frequency3 GHz
Processor manufacturerAMD
Cooler includedNo
Configurable TDP-down155 W
Thermal Design Power (TDP)155 W
Processor cache128 MB
Processor model7313
Processor threads32
Processor boost frequency3.7 GHz
Component forServer/workstation
Processor familyAMD EPYC
Processor cores16
BoxNo
Processor socketSocket SP3
Configurable TDP-up180 W
Processor cache typeL3
Memory
Memory types supported by processorDDR4-SDRAM
Memory clock speeds supported by processor3200 MHz
Memory channelsOcta-channel
Memory bandwidth (max)204.8 GB/s
Graphics
Discrete graphics cardNo
On-board graphics card modelNot available
On-board graphics cardNo
Discrete graphics card modelNot available
Power
Configurable TDP-down155 W
Thermal Design Power (TDP)155 W
Technical details
PCI Express slots version4.0
Thermal Design Power (TDP)155 W
Market segmentServer
Configurable TDP-up180 W
Processor cache typeL3
Features
Maximum number of PCI Express lanes128
Thermal Design Power (TDP)155 W
PCI Express slots version4.0
Market segmentServer
Processor special features
Configurable TDP-up180 W

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