4XG7A38021 - Lenovo SR550/SR590/SR650 XEON GOLD 6226
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Lenovo
4XG7A38021 - Lenovo SR550/SR590/SR650 XEON GOLD 6226
$6,109.97
$3,394.43
(You save
$2,715.54
)
SKU:
4XG7A38021
Availability:
In Stock
Weight:
2.00 LBS
Shipping:
Calculated at Checkout
| Processor | |
|---|---|
| Processor generation | 2nd Generation Intel® Xeon® Scalable |
| Processor base frequency | 2.7 GHz |
| Processor codename | Cascade Lake |
| Thermal Design Power (TDP) | 125 W |
| Processor cache | 19.25 MB |
| Processor model | 6226 |
| Processor threads | 24 |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.7 GHz |
| Number of QPI links | 3 |
| Bus type | UPI |
| Component for | PC |
| Processor lithography | 14 nm |
| Processor family | Intel® Xeon® Gold |
| Processor cores | 12 |
| Processor socket | LGA 3647 (Socket P) |
| Memory | |
| Maximum internal memory supported by processor | 1000 GB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2933 MHz |
| Memory channels | Hexa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 125 W |
| Technical details | |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Execute Disable Bit | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| PCI Express slots version | 3.0 |
| Supported instruction sets | AVX, AVX 2.0, AVX-512, SSE4.2 |
| Scalability | 4S |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Embedded options available | Yes |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 125 W |
| Market segment | Desktop |
| Intel Virtualization Technology (VT-x) | Yes |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Features | |
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 125 W |
| Processor package size | 76 x 56.5 mm |
| Execute Disable Bit | Yes |
| PCI Express slots version | 3.0 |
| Supported instruction sets | AVX, AVX 2.0, AVX-512, SSE4.2 |
| Scalability | 4S |
| Embedded options available | Yes |
| Market segment | Desktop |
| Harmonized System (HS) code | 85423119 |
| Processor special features | |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Intel Turbo Boost Max Technology 3.0 | No |
| Intel® Speed Shift Technology | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Intel® Volume Management Device (VMD) | Yes |
| Intel® Speed Select technology - Performance Profile (Intel® SST-PP) | No |
| Intel® Optane™ DC Persistent Memory Supported | Yes |
| Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
| Intel® vPro™ Platform Eligibility | Yes |
| Intel® Speed Select Technology - Base Frequency (Intel® SST-BF) | No |
| Operational conditions | |
| Tcase | 86 °C |
| Weight & dimensions | |
| Processor package size | 76 x 56.5 mm |
| Other features | |
| Compatibility | ThinkSystem SR550/SR590/SR650 |
Specification:
| Processor | |
|---|---|
| Processor base frequency | 3 GHz |
| Processor manufacturer | AMD |
| Cooler included | No |
| Thermal Design Power (TDP) | 155 W |
| Processor cache | 128 MB |
| Processor model | 7302 |
| Processor threads | 32 |
| Processor operating modes | 32-bit |
| Processor boost frequency | 3.3 GHz |
| Component for | Server/workstation |
| Processor lithography | 7 nm |
| Processor family | AMD EPYC |
| Processor cores | 16 |
| Box | No |
| Processor socket | Socket SP3 |
| Processor cache type | L3 |
| Memory | |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 3200 MHz |
| Memory channels | Octa-channel |
| Memory bandwidth (max) | 204.8 GB/s |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 155 W |
| Technical details | |
| PCI Express slots version | 4.0 |
| Thermal Design Power (TDP) | 155 W |
| Market segment | Server |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 128 |
| Thermal Design Power (TDP) | 155 W |
| PCI Express slots version | 4.0 |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
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