Specification:
Processor | |
---|---|
Processor generation | 1st Generation Intel® Xeon® Scalable |
Processor base frequency | 2.6 GHz |
Processor manufacturer | Intel |
Cooler included | Yes |
Thermal Design Power (TDP) | 125 W |
Processor cache | 19.25 MB |
Processor model | 6126T |
Processor threads | 24 |
Processor operating modes | 64-bit |
Processor boost frequency | 3.7 GHz |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel® Xeon® Gold |
Processor cores | 12 |
Processor socket | LGA 3647 (Socket P) |
Processor cache type | L3 |
Memory | |
Maximum internal memory supported by processor | 768 GB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2666 MHz |
Memory channels | Hexa-channel |
ECC | Yes |
Graphics | |
On-board graphics card | No |
Power | |
Thermal Design Power (TDP) | 125 W |
Technical details | |
Intel TSX-NI | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | AVX,AVX 2.0,AVX-512,SSE4.2 |
Scalability | S4S |
Embedded options available | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 125 W |
Market segment | Server |
Intel Virtualization Technology (VT-x) | Yes |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 125 W |
Processor package size | 76 x 56.5 mm |
PCI Express slots version | 3.0 |
Supported instruction sets | AVX,AVX 2.0,AVX-512,SSE4.2 |
Scalability | S4S |
Embedded options available | Yes |
Market segment | Server |
Processor special features | |
Intel 64 | Yes |
Conflict-Free processor | Yes |
Intel Turbo Boost Max Technology 3.0 | No |
Intel® Speed Shift Technology | Yes |
Intel® Optane™ Memory Ready | No |
Intel TSX-NI | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
Intel® vPro™ Platform Eligibility | Yes |
Operational conditions | |
Tcase | 86 °C |
Weight & dimensions | |
Processor package size | 76 x 56.5 mm |