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4XG7A08848 - Lenovo SR950 XEON 6136 12C/150W/3.0GHZ

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SKU: 4XG7A08848
Availability: In Stock
Weight: 2.00 LBS
Shipping: Calculated at Checkout
46C566DB-4644-460E-8DA7-038C0B9646AB E06A9D60-42A9-4459-8131-FA3002495928
The SR950 supports the Gold and Platinum level processors in the Intel Xeon Processor Scalable Family, including the "top bin" highest performing 205 W processors available from Intel. The server supports up to four or eight processors, depending on the configuration selected, however processors are all installed within the 4U rack enclosure: - For configurations that support up to eight processors, the server supports 2, 4 or 8 processors. (There is no support for 6-processor configurations.) - For configurations of up to four processors (lower cost configuration, no upgrade path to eight processors), the server supports 2 or 4 processors

 

Specification:

 

Processor
Processor generation1st Generation Intel® Xeon® Scalable
Processor base frequency3.6 GHz
Cooler includedYes
Thermal Design Power (TDP)105 W
Processor cache16.5 MB
Processor model5122
Processor threads8
Processor operating modes64-bit
Processor boost frequency3.7 GHz
Component forServer/workstation
Processor lithography14 nm
Processor familyIntel® Xeon® Gold
Processor cores4
Processor socketLGA 3647 (Socket P)
Processor cache typeL3
Memory
Maximum internal memory supported by processor768 GB
Memory types supported by processorDDR4-SDRAM
Memory clock speeds supported by processor2666 MHz
Memory channelsHexa-channel
ECCYes
Graphics
On-board graphics cardNo
Power
Thermal Design Power (TDP)105 W
Technical details
Intel TSX-NIYes
Intel® Turbo Boost Technology2.0
Intel Trusted Execution TechnologyYes
Intel® Hyper Threading Technology (Intel® HT Technology)Yes
Intel® AES New Instructions (Intel® AES-NI)Yes
PCI Express slots version3.0
Supported instruction setsAVX 2.0,AVX-512,SSE4.2
ScalabilityS4S
Embedded options availableNo
Intel 64Yes
Thermal Design Power (TDP)105 W
Market segmentServer
Intel Virtualization Technology (VT-x)Yes
Processor cache typeL3
Features
Maximum number of PCI Express lanes48
Thermal Design Power (TDP)105 W
Processor package size76 x 56.5 mm
PCI Express slots version3.0
Supported instruction setsAVX 2.0,AVX-512,SSE4.2
ScalabilityS4S
Embedded options availableNo
Market segmentServer
Processor special features
Intel 64Yes
Conflict-Free processorYes
Intel Turbo Boost Max Technology 3.0No
Intel® Speed Shift TechnologyYes
Intel® Optane™ Memory ReadyNo
Intel TSX-NIYes
Intel® Turbo Boost Technology2.0
Intel Trusted Execution TechnologyYes
Intel® Hyper Threading Technology (Intel® HT Technology)Yes
Intel® AES New Instructions (Intel® AES-NI)Yes
Intel Virtualization Technology (VT-x)Yes
Intel® vPro™ Platform EligibilityYes
Operational conditions
Tcase71 °C
Weight & dimensions
Processor package size76 x 56.5 mm

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