4XG7A07217 - Lenovo THINKSYSTEM ST550 INTEL XEON SILVER 4108 8C 85W 1.8GHZ PROCESSOR OPTION KIT

Intel® AES New Instructions (Intel® AES-NI) are a set of instructions that enable fast and secure data encryption and decryption. AES-NI are valuable for a wide range of cryptographic applications, for example: applications that perform bulk encryption/decryption, authentication, random number generation, and authenticated encryption. Intel® Trusted Execution Technology for safer computing is a versatile set of hardware extensions to Intel® processors and chipsets that enhance the digital office platform with security capabilities such as measured launch and protected execution. It enables an environment where applications can run within their own space, protected from all other software on the system. Intel® Virtualization Technology (VT-x) allows one hardware platform to function as multiple “virtual” platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions.

 

Specification:

 

Processor
Processor generation	1st Generation Intel® Xeon® Scalable
Processor base frequency	1.7 GHz
Processor codename	Skylake
Thermal Design Power (TDP)	85 W
Processor cache	11 MB
Processor model	3106
Processor threads	8
Processor operating modes	64-bit
Component for	Server/workstation
Processor lithography	14 nm
Processor family	Intel Xeon Bronze
Processor cores	8
Processor socket	LGA 3647 (Socket P)
Processor cache type	L3
Memory
Maximum internal memory supported by processor	768 GB
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	2133 MHz
Memory channels	Hexa-channel
ECC	Yes
Graphics
On-board graphics card	No
Power
Thermal Design Power (TDP)	85 W
Technical details
Intel TSX-NI	Yes
Intel® Turbo Boost Technology	No
Intel Trusted Execution Technology	Yes
Intel® Hyper Threading Technology (Intel® HT Technology)	No
Intel® AES New Instructions (Intel® AES-NI)	Yes
PCI Express slots version	3.0
Scalability	2S
Embedded options available	Yes
Intel 64	Yes
Thermal Design Power (TDP)	85 W
Market segment	Server
Intel Virtualization Technology (VT-x)	Yes
Processor cache type	L3
Features
Maximum number of PCI Express lanes	48
Thermal Design Power (TDP)	85 W
Processor package size	76 x 56.5 mm
PCI Express slots version	3.0
Scalability	2S
Embedded options available	Yes
Market segment	Server
Processor special features
Intel 64	Yes
Conflict-Free processor	Yes
Intel Turbo Boost Max Technology 3.0	No
Intel® Speed Shift Technology	Yes
Intel® Optane™ Memory Ready	No
Intel TSX-NI	Yes
Intel® Turbo Boost Technology	No
Intel Trusted Execution Technology	Yes
Intel® Hyper Threading Technology (Intel® HT Technology)	No
Intel® AES New Instructions (Intel® AES-NI)	Yes
Intel Virtualization Technology (VT-x)	Yes
Intel® vPro™ Platform Eligibility	Yes
Operational conditions
Tcase	77 °C
Weight & dimensions
Processor package size	76 x 56.5 mm
Other features
Compatibility	Lenovo ThinkSystem ST550