11TDS0AK05 - Lenovo EGISS AMERICA INC

The power to fuel productivity Powered by up to 12th Gen Intel® Core™ i9 processors Intel® Wi-Fi 6E* for faster data transfer and reduced videoconferencing latency ThinkShield end-to-end protection and EC Self-healing BIOS Connect up to four displays for exceptional customization Real-world durability, MIL-STD 810H Certified *16GHz Wi-Fi 6E operation is dependent on the support of the operating system, routers/APs/Gateways that support Wi-Fi 6E, and the regional regulatory certifications and spectrum allocation.

 

Specification:

 

Processor
Processor generation	12th gen Intel® Core™ i5
Bus type	DMI4
Processor cache	18 MB
Processor model	i5-12500
Processor manufacturer	Intel
Processor boost frequency	4.6 GHz
Processor cores	6
Processor family	Intel® Core™ i5
Memory
Internal memory	8 GB
Maximum internal memory	128 GB
Memory slots	4x DIMM
Internal memory type	DDR5-SDRAM
Memory clock speed	4400 MHz
Memory channels	Dual-channel
Storage
Storage media	SSD
Number of storage drives installed	1
Optical drive type	DVD±RW
SSD interface	PCI Express 4.0
SSD capacity	256 GB
Number of SSDs installed	1
Card reader integrated	No
Total storage capacity	256 GB
SSD form factor	M.2
Total SSDs capacity	256 GB
NVMe	Yes
Graphics
Discrete graphics card	No
On-board graphics card	Yes
Discrete graphics card model	Not available
On-board graphics card model	Intel UHD Graphics 770
Optical drive
Optical drive type	DVD±RW
Network
Ethernet LAN	Yes
Wi-Fi	No
Ethernet LAN data rates	100,1000 Mbit/s
Cabling technology	10/100/1000Base-T(X)
Ports & interfaces
Combo headphone/mic port	Yes
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity	6
USB 3.2 Gen 2 (3.1 Gen 2) Type-A ports quantity	2
USB 3.2 Gen 2 (3.1 Gen 2) Type-C ports quantity	1
HDMI version	2.1
Microphone in	Yes
Line-out	Yes
Headphone outputs	1
HDMI ports quantity	1
Ethernet LAN (RJ-45) ports	1
DisplayPorts quantity	2
DisplayPort version	1.4
Technical details
Intel 64	Yes
Cable lock slot type	Kensington
Product type	PC
Trusted Platform Module (TPM)	Yes
Product colour	Black
Chassis type	Tower
Cable lock slot	Yes
Motherboard chipset	Intel Q670
Design
Volume	13.6 L
Cable lock slot type	Kensington
Product colour	Black
Chassis type	Tower
Cable lock slot	Yes
Performance
Embedded options available	No
Number of speakers	1
Password protection	Yes
Password protection type	BIOS, HDD, Power on, Supervisor
Product type	PC
Trusted Platform Module (TPM)	Yes
Built-in speaker(s)	Yes
Motherboard chipset	Intel Q670
Software
Operating system language	English
Operating system architecture	64-bit
Operating system installed	Windows 11 Pro
Processor special features
Embedded options available	No
Enhanced Intel SpeedStep Technology	Yes
Intel VT-x with Extended Page Tables (EPT)	Yes
Intel Trusted Execution Technology	Yes
Intel Stable Image Platform Program (SIPP)	Yes
Idle States	Yes
Execute Disable Bit	Yes
Intel Virtualization Technology for Directed I/O (VT-d)	Yes
CPU configuration (max)	1
Intel Virtualization Technology (VT-x)	Yes
Intel 64	Yes
Power
Power supply input frequency	50/60 Hz
Power supply input voltage	100 - 240 V
Power supply	260 W
Operational conditions
Operating altitude	0 - 120000" (0 - 3048 m)
Storage temperature (T-T)	-40 - 60 °C
Operating relative humidity (H-H)	20 - 80%
Storage relative humidity (H-H)	10 - 90%
Operating temperature (T-T)	5 - 35 °C
Non-operating altitude	0 - 480000" (0 - 12192 m)
Certificates
Certification	ErP Lot 3 TCO Certified 9.0 RoHS MIL-STD-810H
Weight & dimensions
Volume	13.6 L
Package width	9.65" (245 mm)
Package depth	15.6" (395 mm)
Package height	20.9" (530 mm)
Width	5.71" (145 mm)
Depth	11.7" (296 mm)
Height	13.6" (346 mm)
Package weight	18.3 lbs (8.3 kg)
Weight	13 lbs (5.9 kg)
Packaging data
Package width	9.65" (245 mm)
Package depth	15.6" (395 mm)
Package height	20.9" (530 mm)
Package weight	18.3 lbs (8.3 kg)
Packaging content
Mouse included	Yes
Display included	No
Keyboard included	Yes
Other features
Number of speakers	1
Trusted Platform Module (TPM)	Yes
On-board graphics card	Yes
Processor manufacturer	Intel
Built-in speaker(s)	Yes